IP Library Granted Patent US 7,113,688
Granted Patent B2
US 7,113,688 · App. 11/037,883 · Granted Sep 26, 2006

Base, payload and connecting structure and methods of making the same

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Quick Facts
Patent No.
US 7,113,688
App. No.
11/037,883
Granted
Sep 26, 2006
Kind
B2
Abstract

Micromachined passive alignment assemblies and methods of using and making the same are provided. The alignment assemblies are used to align at least one optical element. The alignment assemblies may be configured with kinematic, pseudo-kinematic, redundant or degenerate support structures. One alignment assembly comprises a base and a payload, which supports at least one optical element. The payload may be coupled to the base via connecting structures. The base, the payload and/or the connecting structures may have internal flexure assemblies for preloading a connection, thermal compensation and/or strain isolation.

Claims (11)

1. An assembly configured to support at least one optical element to a pre-determined position, the assembly comprising:

a payload having three protrusions, each protrusion having four sidewalls, each sidewall being substantially perpendicular to a plane of the payload; and

a micromachined structure having three grooves, the grooves being configured to contact the protrusions to restrain the micromachined structure with respect to the payload in six degrees-of-freedom (DOFs), the payload supported at a pre-determined position, wherein each protrusion has a sidewall facing a center point of the micromachined structure.

2. The assembly of claim 1 , wherein the assembly comprises a passive alignment assembly.

3. The assembly of claim 1 , wherein the micromachined structure is fabricated using a lithographic micromachining process.

4. The assembly of claim 1 , wherein the optical element is an optical fiber.

5. The assembly of claim 1 , wherein the optical element is a lens.

6. The assembly of claim 1 , wherein the optical element is a mirror.

7. The assembly of claim 1 , wherein the optical element is a diode.

8. The assembly of claim 1 , wherein the micromachined structure is formed from substantially flat silicon wafers.

9. The assembly of claim 1 , wherein the micromachined structure comprises substantially planar wafers.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →