IP Library › Granted Patent US 7,262,498
Granted Patent B2
US 7,262,498 · App. 11/038,374 · Granted Aug 28, 2007

Assembly with a ring and bonding pads formed of a same material on a substrate

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Quick Facts
Patent No.
US 7,262,498
App. No.
11/038,374
Granted
Aug 28, 2007
Kind
B2
Abstract

An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.

Claims (30)

1. An assembly, comprising:

a substrate;

a device coupled to said substrate;

a ring formed on said substrate around said device and extending from said substrate higher than said device such that a cover can be sealed to said ring over said device; and

one or more bonding pads formed on said substrate exterior to and separate from said ring, said bonding pad being formed of a conductive material and configured for making an electrical connection between said device and an external circuit,

wherein said ring and bonding pads are formed of a same material.

2. The assembly of claim 1 , wherein said material comprises solder.

3. The assembly of claim 2 , wherein said material comprises AuSn solder.

4. The assembly of claim 3 , wherein said AuSn solder comprises 80 Au/20 Sn eutectic solder.

5. The assembly of claim 1 , and further comprising said cover hermetically sealed to said substrate by said ring.

6. The assembly of claim 5 , wherein said cover comprises a glass lid.

7. The assembly of claim 1 , and further comprising one or more leads extending between said device and said bonding pads.

8. The assembly of claim 7 , wherein at least one of said one or more leads comprise aluminum wires having titanium deposited on at least a portion thereof.

9. An electronic device, comprising:

an substrate having a device supported thereon;

a ring also disposed on said substrate, wherein said ring surrounds said device such that a cover can be sealed to said ring over said device;

bonding pads formed on said substrate exterior to and separate from said ring, said bonding pad being formed of a conductive material and electrically connected to said device, said bonding pads and ring being formed of substantially the same material;

a circuit having circuit leads electrically coupled to said bonding pads; and

a controller coupled to said circuit.

10. The device of claim 9 , wherein said circuit comprises a tape-automated bond circuit.

11. The device of claim 9 , wherein said bonding pads and said ring are on a single side of said substrate.

12. The device of claim 9 , wherein said bonding pads comprise solder.

13. The assembly of claim 1 , wherein said device comprises a micro-electromechanical device.

14. The assembly of claim 1 , further comprising wire leads connected to said bonding pads, wherein a portion of a wire lead connected to one of said bonding pads comprises a conductive diffusion barrier material deposited on said wire lead.

15. The assembly of claim 14 , wherein said diffusion barrier material comprises titanium or tantalum.

16. The assembly of claim 14 , wherein said wire lead comprises aluminum wire and said bonding pad comprises solder.

17. The assembly of claim 1 , wherein said ring is formed exclusively of a material also used to form said bonding pads.

18. The device of claim 9 , wherein said ring is formed exclusively of a material also used to form said bonding pads.

19. The device of claim 1 , wherein said ring and bonding pads are both formed directly on a surface of said substrate.

20. The device of claim 1 , wherein said cover is sealed directly to said ring.