Method of an array of structures sensitive to ESD and structure made therefrom
View Patent ↗A method of fabricating an array of structures sensitive to ESD is disclosed. First, an array of structures is provided on a substrate, with the structures conductively coupled by interconnections. Thereafter, the interconnections are removed before fabricating another array of structures. Therefore, the structures have equal potential. Further, an electrostatic discharge structure is provided near the periphery of the substrates.
1. A method of fabricating on a substrate, an array of structures sensitive to ESD, comprising:
providing an electrostatic discharge structure near the periphery of the substrate;
forming the array of structures on the substrate, with the structures being conductively coupled by interconnections in a manner such that the array of structures are at same potential, wherein the array of structures is conductively connected to the electrostatic discharge structure for electrostatic protection without directly connecting each structure in the array of structures to the electrostatic discharge structure; and
conductively decoupling the array of structures to separate the structures conductively.
2. The method as in claim 1 , wherein the array of structures each comprises an individual circuit.
3. The method as in claim 1 , wherein the array of structures comprises an array of TFT.
4. The method as in claim 1 , wherein the step of providing the electrostatic discharge structure comprises:
providing a first tip conductively coupled to the array of structures; and
providing a second tip grounded, wherein electrostatic charges can be discharged from one tip to the other.
5. The method as in claim 4 , wherein the first tip and the second tip are facing or mismatching from each other without connection.
6. The method as in claim 1 , wherein the step of forming the array of structures on the substrate comprises:
forming a first conductive layer on the substrate; and
patterning the first conductive layer to form the array of structures and the interconnections within the first conductive layer.
7. The method as in claim 1 , wherein the electrostatic discharge structure is provided by forming the electrostatic discharge structure during the step of forming the array of structures.
8. The method as in claim 6 , further comprising:
forming a second conductive layer above the first conductive layer after the array of structures have been conductively decoupled.
9. The method as in claim 8 , wherein the step of forming the second conductive layer includes providing an insulating layer on the first conductive layer prior to forming an array of structures in the second conductive layer.
10. The method of claim 1 , wherein the step of conductively decoupling the array of structures includes conductively breaking the interconnections.
11. The method of claim 10 , wherein the step of conductively breaking the interconnections includes removing the interconnections.
12. The method of claim 6 , wherein the array of structure comprises a plurality of independent circuits, and the interconnections connect the plurality of independent circuits.
13. The method of claim 12 , wherein the plurality of independent circuits and the plurality of interconnections are of the same conductive material in the first conductive layer.