Off-grid decoupling of ball grid array (BGA) devices and method
View Patent ↗A multilayered printed wiring board having a ball grid array (BGA) land pattern in which each land in the pattern is connected to a respective via by a link connector, a method of adapting spacing between selected adjacent via and respective link pairs to receive decoupling capacitor pads, comprising rotating, elongating and/or truncating the selected adjacent pairs and rotating their respective corresponding via pairs to adapt the spacing between the selected adjacent via pairs in the BGA land pattern and applying the capacitor pads to the selected via pairs. The selected adjacent via pairs and their respective link connectors are rotated, elongated and/or truncated in mutually opposite directions.
1. In a multilayered printed wiring board, a ball grid array (BGA) land pattern in which each land in said pattern is connected to a respective via by a link connector, a method of adapting spacing between selected adjacent via and respective link pairs to receive decoupling capacitor pads, comprising:
rotating, elongating and/or truncating said selected adjacent link pairs and rotating their respective corresponding via pairs to adapt the spacing between said selected adjacent via pairs in said BGA land pattern and applying said capacitor pads to said selected via pairs.
2. The method defined in claim 1 wherein said selected adjacent via pairs and their respective link connectors are rotated, elongated and/or truncated in mutually opposite directions.
3. A printed wiring board in which via and link connector pattern has been modified in accordance with the method described in claim 1 .