Method of producing a piezocomposite
View Patent ↗A method of preparing a composite sheet unit includes arranging a plurality of sintered piezoelectric thin wires in a uniform direction on a surface of a resin layer is prepared. A plurality of the same are laminated and integrated so that the sintered piezoelectric thin wires are positioned between the resin layers. Here, a curing resin may be impregnated therein so as to form resin-impregnated-cured portions. Then, the lamination is cut in a direction crossing a lengthwise direction of the sintered piezoelectric thin wires, so that a piezocomposite is obtained. Cut surfaces may be ground. By so doing, it is possible to provide a highly reliable piezocomposite having a fine structure at low cost, and to provide an ultrasonic probe for ultrasonic diagnostic equipment, as well as ultrasonic diagnostic equipment using the same.
1. A method for producing a piezocomposite, comprising the steps of:
(a) preparing a sintered piezoelectric plate having a thickness ranging from 10 μm to 500 μm;
(b) forming a resin layer on the sintered piezoelectric plate;
(c) forming a plurality of parallel cut grooves in the sintered piezoelectric plate provided with the resin layer, without completely dividing the resin layer, so as to cut the sintered piezoelectric plate into a plurality of sintered piezoelectric thin wires;
(d) repeating the steps (a) to (c) a plurality of times, so as to prepare a plurality of composite sheet units on a surface of each of which a plurality of the sintered piezoelectric thin wires are arranged in a uniform direction;
(e) laminating a plurality of the composite sheet units so that the sintered piezoelectric thin wires are positioned between the resin layers; and
(f) integrating the plurality of the composite sheet units after the laminating to obtain said piezocomposite.
2. The method according to claim 1 , wherein the forming of the plurality of the parallel cut grooves in the step (c) is carried out by at least one selected from a sand-blasting technique and a dicing technique.
3. The method according to claim 1 , further comprising a step of impregnating a resin in void portions after the lamination and integration of the plurality of the composite sheet units and curing the composite sheet units.
4. The method according to claim 1 , further comprising a step of cutting the integrated lamination of the composite sheet units in a direction perpendicular to a lengthwise direction of the sintered piezoelectric thin wires, so as to obtain a plurality of piezocomposite pieces.
5. The method according to claim 1 , further comprising a step of grinding the piezocomposite along a plane crossing a lengthwise direction of the sintered piezoelectric thin wires in the piezocomposite.
6. The method according to claim 1 , wherein the step (e) of laminating the composite sheet units includes a sub-step of providing adhesive resin sheets between the composite sheet units.
7. The method according to claim 1 , wherein the step (e) of laminating the composite sheet units includes a sub-step of forming an adhesive layer on at least apart of the resin layer in each composite sheet unit.
8. The method according to claim 1 , wherein a technique used for integrating the plurality of the composite sheet units is a technique of impregnating a resin between the composite sheet units and curing the same composite sheet units.