IP Library Granted Patent US 7,424,727
Granted Patent B2
US 7,424,727 · App. 11/043,494 · Granted Sep 9, 2008

Disk array device and disk array device housing

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Quick Facts
Patent No.
US 7,424,727
App. No.
11/043,494
Granted
Sep 9, 2008
Kind
B2
Abstract

The disk array device ( 100 ) comprises at least one object of cooling that includes at least one of a plurality of disk type storage devices ( 150 ), and cooling parts ( 31 U, 31 L) that cool said object of cooling indirectly by means of a cooling medium.

Claims (21)

1. A disk array device which has a plurality of disk type storage devices, comprising:

at least one object of cooling that includes at least one of the plurality of disk type storage devices;

a cooling part; and

an air intake part which takes in air that is present on the outside of said disk array device, and feeds said taken-in air into said cooling part, and comprises said cooling part on the upstream side of said air with respect to said object of cooling,

wherein said cooling part cools said taken-in air to produce cooled air to cool said of object of cooling.

2. The disk array device according to claim 1 , wherein said cooling part is a radiator.

3. The disk array device according to claim 2 , wherein said radiator includes a cooling medium flowing therein.

4. The disk array device according to claim 3 , further comprising a compressor connected to said cooling part to effect removal of heat from said cooling medium.

5. The disk array device according to claim 3 , wherein said cooling medium is a fluid.

6. A method of cooling a disk array device comprising:

receiving air from outside of said disk array device as taken-in air;

cooling said taken-in air to produce cooled air; and

cooling one or more objects comprising said disk array device with said cooled air,

wherein said cooling part includes a radiator having a cooling medium therein, said cooling medium receiving heat from said taken-in air thereby cooling said taken-in air.

7. The method of claim 6 wherein said one or more objects of said disk array device include a plurality of disk storage devices.

8. The method of claim 6 wherein said step of cooling said taken-in air includes passing said taken-in air across a cooling part.

9. The method of claim 6 wherein said cooling medium is a fluid.

10. A method of cooling a disk array device which has a plurality of disk type storage devices, the method comprising:

feeding air from outside of said disk array device into a cooling part, said cooling part comprising a cooling medium, said cooling part connected to a compressor to remove heat from said cooling medium;

producing cooled air with said cooling part, and

cooling at least one of the plurality of disk type storage devices with said cooled air.

Assignments (2)
COMPANY SPLIT Recorded Aug 20, 2024
From: HITACHI, LTD.
To: HITACHI VANTARA, LTD.
Reel/Frame 069518/0761 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2005
From: TANAKA, SHIGEAKI
To: HITACHI LTD.
Reel/Frame 016236/0172 →