Monodisperse spherical metal particles and manufacturing method therefor
View Patent ↗It is an object of the present invention to provide spherical metal particles having excellent monodispersity. The present invention relates to a method of manufacturing monodisperse spherical metal particles characterized by passing liquid metal through a porous membrane so as to disperse the resulting liquid metal particles in a continuous liquid phase.
1. A method of manufacturing monodisperse spherical metal particles, comprising passing liquid metal through a porous membrane and dispersing the resulting liquid metal particles directly in a continuous liquid phase.
2. The method according to claim 1 , wherein the porous membrane is a porous glass membrane.
3. The method of claim 2 , wherein the monodisperse spherical metal particles have a mean particle diameter in the range of 0.1-160 μm.
4. The method according to claim 1 , wherein the liquid metal is a metal having a melting point of at most 250° C. which has been melted.
5. The method according to claim 1 , wherein the continuous liquid phase further contains a dispersant.
6. The method according to claim 5 , wherein the dispersant is a metallic soap.
7. The method of claim 1 , wherein the monodisperse spherical metal particles have a mean particle diameter (particle diameter corresponding to 50 vol % in the cumulative volume distribution) in the range of 0.1-1000 μm.
8. The method of claim 1 , wherein the monodisperse spherical metal particles have a cumulative volume distribution in which:
(a) a particle diameter corresponding to 10 vol % in the distribution is at least 60% of the particle diameter corresponding to 50 vol % in the distribution; and
(b) a particle diameter corresponding to 90 vol % in the distribution is at most 125% of the particle diameter corresponding to 50 vol % in the distribution.
9. The method of claim 8 , wherein a particle diameter corresponding to 50 vol % in the distribution is 10 μm or smaller.
10. The method of manufacturing monodisperse spherical metal particles as claimed in claim 1 as solder balls for BGA/CSP type packages.