Film substrate, fabrication method thereof, and image display substrate
View Patent ↗In a film substrate (FB) including a film base material ( 1 ) and conductor wiring ( 23 ) that is formed on the film base material ( 1 ), the conductor wiring ( 23 ) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) ( 25 ) at other positions.
1. A film substrate comprising;
a film base material;
a semiconductor element;
an image display panel;
a print substrate; and
a conductor wiring formed on the film base material, the conductor wiring comprising:
a bent portion which is in an area of the conductor wiring which is bent;
a semiconductor connection portion which connects the semiconductor element to the conductor wiring;
an external connection portion which connects the image display panel or the print substrate to the conductor wiring;
and an insulating film which covers the conductor wiring except for the semiconductor connection portion and the external connection portion,
wherein a thickness of the semiconductor connection portion is the same as that of the external connect portion, the thickness of the external connection portion and the semiconductor connection portion are greater than that of the bent portion, and
a thickness of the insulating film is smaller than that of the semiconductor connection portion and the external connection portion on the film substrate.
2. The film substrate according to claim 1 , wherein the thickness of the semiconductor connection portion and the thickness of the external connection portion are each thicker than the thickness of the conductor wiring portion at other positions.
3. The film substrate according to claim 1 , the film substrate further comprising;
a plurality of film substrate conveyance film holes;
a plurality of reinforcement conductors formed at a periphery of the plurality of film substrate conveyance film holes,
wherein a thickness of the plurality of reinforcement conductors is thicker than a thickness of the conductor wiring portion at other positions in a similar fashion to the external connection portion on the film substrate.
4. The film substrate according to claim 1 , wherein the bent portion is bent when the film substrate is mounted on the panel or the substrate.
5. The film substrate according to claim 1 , the film substrate further comprising three layers placed between the external connection portion and the image display panel or the print substrate,
wherein a first layer is placed on the image display panel or the print substrate, a second layer is placed on the first layer, a third layer is placed on the second layer and the external connection portion, and
wherein a thickness of the third layer is larger than that of the first layer.
6. The film substrate according to claim 1 , wherein a region of the conductor wiring other than the semiconductor connection portion and the external connection portion is covered by an insulating film having a lower thickness than the semiconductor connection portion and the external connection portion.
7. The film substrate according to claim 1 , wherein the image display substrate is connected with the film substrate and the print substrate.