Apparatuses and methods for forming assemblies
View Patent ↗Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming a flexible active matrix display along a length of flexible substrate. Another embodiment of the invention relates to forming multiple flexible displays along a continuous flexible substrate. Another embodiment of the invention relates to forming a flexible display along a flexible reflective substrate. Another embodiment of the invention relates to using FSA generally with a flexible web process material. Another embodiment of the invention relates to using FSA and a deterministic method such as “pick and place” to place objects onto a rigid substrate or onto a web process material. Another embodiment of the invention relates to using web processing to deposit and/or pattern display material through an in-line process.
1. A method of processing a flexible substrate, said method comprising:
moving a flexible substrate through at least one web process apparatus;
dispensing a slurry containing a plurality of shaped objects onto said flexible substrate, said shaped objects being deposited onto receptor regions of said flexible substrate.
2. The method as in claim 1 wherein said flexible moves at a rate of 5 inches per minute to 100 inches per minute.
3. The method as in claim 1 wherein a display tape moves at a rate of 5 inches per minute to 100 inches per minute.
4. The method as in claim 3 wherein the display tape comprises a material selected from a group of polyether sulfone (PES), polyester terephthalate, polycarbonate, polybutylene terephthalate, polyphenylene sulfide (PPS), polypropylene, polyester, aramid, polyamide-imide (PAI), polyimide, aromatic polyimides, polyetherimide, metallic materials, acrylonitrile butadiene styrene, and polyvinyl chloride.
5. A method for continuously feeding a flexible substrate and display tape through a production line to form a display panel comprising:
moving a flexible substrate and a display tape;
placing a slurry onto said flexible substrate said sluny having a plurality of shaped blocks which are designed to be received by receiving regions of said flexible substrate;
coupling said flexible substrate to said display tape;
coupling said flexible substrate to a backplane;
said display tape comprises a material selected from a group of polyether sulfone (PES), polyester terephthalate, polycarbonate, polybutylene terephthalate, polyphenylene sulfide (PPS), polypropylene, polyester, aramid, polyamide-imide (PAI), polyimide, aromatic polyimides, polyetherimide, metallic materials, acrylonitrile butadiene styrene, and polyvinyl chloride.
6. The method as in claim 5 wherein said display tape is flexible.
7. The method as in claim 5 wherein the display tape comprises any one of an organic light emitting diode, a light emitting diode, an inorganic light emitting diode, a cholesteric liquid crystal, an upconverting phosphorus, a downconverting phosphorus, an electrophoretic material, a liquid crystal and a polymer-dispersed liquid crystal.
8. A method of manufacturing flexible electronic assemblies comprising:
depositing a plurality of blocks onto a flexible substrate, each of said blocks being rigid, and having a circuit element formed thereon and having a size that is substantially smaller in comparison to said flexible substrate; and
forming interconnects to electrically couple each of said blocks to an electronic component;
wherein said flexible substrate is continuous and is advanced through a web processing apparatus during said method of manufacturing said flexible electronic assemblies.
9. The method as in claim 8 wherein the blocks are shaped single crystal semiconductor blocks.
10. The method as in claim 8 further comprising separating said flexible substrate into individual flexible electronic assemblies.
11. The method as in claim 8 further comprising depositing a planarization material over said flexible substrate wherein said coupling electrically occurs only at top surfaces of said plurality of blocks.
12. The method as in claim 8 wherein said flexible substrate comprises recessed regions of different sizes wherein said plurality of blocks of different sizes are deposited into said recessed regions.
13. The method as in claim 8 wherein said interconnects include a flexible antenna.
14. The method as in claim 8 wherein said interconnects electronically couple each of said blocks to a flexible antenna.
15. The method as in claim 8 wherein said plurality of blocks are deposited onto said flexible substrate using a FSA process.
16. The method as in claim 8 wherein said plurality of blocks comprises blocks with sensor elements.