IP Library Granted Patent US 7,567,016
Granted Patent B2
US 7,567,016 · App. 11/051,349 · Granted Jul 28, 2009

Multi-dimensional ultrasound transducer array

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,567,016
App. No.
11/051,349
Granted
Jul 28, 2009
Kind
B2
Abstract

In k 31 mode, a vibration is along an axis or orthogonal to the poling or electric field orientation. The direction of vibration is toward a face of an ultrasound transducer array. For each element of the array, electrodes are formed perpendicular to the face of the array, such as along the sides of the elements. Piezoelectric material is poled along a dimension parallel with the face of the transducer and perpendicular to the direction of acoustic energy propagation. Using elements designed for k 31 resonant mode operation may provide for a better electrical impedance match, such as where small elements sizes are provided for a multi-dimensional transducer arrays. For additional impedance matching, the elements may be made from multiple layers of piezoelectric ceramic. Since the elements operate from a k 31 mode, the layers are stacked along the poling direction or perpendicular to a face of the transducer array for transmitting or receiving acoustical energy.

Claims (21)

1. An ultrasound transducer array for converting between acoustic and electrical energies, the array comprising:

a first transducer element operable in a k 31 resonance mode along a longitudinal displacement direction, the first transducer element having a top, a bottom and at least three sides relative to the longitudinal displacement direction; and

a first electrode within the first transducer element and a second electrode on each of the at least three sides, the first and second electrodes being electrically isolated from each other.

2. The array of claim 1 , wherein the first transducer element includes:

a first layer of transducer material; and

a second layer of transducer material disposed substantially parallel to the first layer of transducer material;

wherein the first and second layers of transducer material are arranged substantially perpendicular to the top.

3. The array of claim 2 further comprising a third layer, wherein the third layer is disposed between first and second layers of transducer material.

4. The array of claim 3 further comprising a third electrode, wherein the third electrode is disposed between the first and second layers.

5. The array of claim 4 , wherein the third electrode is electrically connected to one of the first and second electrodes.

6. The array of claim 1 , wherein the top is an acoustic surface.

7. The array of claim 1 , wherein the first electrode is carried between the first and second layers of transducer material, and wherein the second electrode is carried on an outer surface of the second layer.

8. The array of claim 1 , wherein the at least three sides are disposed substantially perpendicular to the top, and wherein the at least three sides has a height that is at least twice the width of the first and second layers of transducer material.

9. The array of claim 1 further comprising:

a second transducer element; and

a third transducer element;

wherein the first, second and third elements are arranged to define a multi-dimensional array.

10. The array of claim 1 , wherein the first transducer element comprises four or more sub-elements and wherein each of the sub-elements includes first and second layers of transducer materials.

11. The array of claim 1 further comprising:

a matching layer generally parallel with and adjacent to the top.

12. The array of claim 1 , wherein first transducer element poled in a direction substantially perpendicular to the longitudinal displacement direction.

Assignments (4)
RELEASE OF FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT (RELEASES RF 028149/0521) Recorded Aug 7, 2014
From: TCO FUNDING CORP.
To: TENSAR HOLDINGS, LLC; TENSAR CORPORATION; TENSAR CORPORATION, LLC; TENSAR INTERNATIONAL, LLC; TENSAR INTERNATIONAL CORPORATION; TENSAR POLYTECHNOLOGIES, INC.; GEOPIER FOUNDATION COMPANY, INC.; GEOTECHNICAL REINFORCEMENT COMPANY, INC.; NORTH AMERICAN GREEN, INC.
Reel/Frame 033500/0443 →
RELEASE OF COLLATERAL ASSIGNMENT OF INTELLECTUAL PROPERTY SECURITY (RELEASES RF 028177/0029) Recorded Aug 7, 2014
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: TCO FUNDING CORP.
Reel/Frame 033500/0564 →
COLLATERAL ASSIGNMENT OF INTELLECTUAL PROPERTY SECURITY RECORDED AT REEL/FRAME 028149/0521 Recorded May 8, 2012
From: TCO FUNDING CORP.
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 028177/0029 →
FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded May 3, 2012
From: TENSAR HOLDINGS, LLC; TENSAR CORPORATION; TENSAR CORPORATION, LLC; TENSAR INTERNATIONAL, LLC; TENSAR INTERNATIONAL CORPORATION; TENSAR POLYTECHNOLOGIES, INC.; GEOPIER FOUNDATION COMPANY, INC.; GEOTECHNICAL REINFORCEMENT COMPANY, INC.; NORTH AMERICAN GREEN, INC.
To: TCO FUNDING CORP.
Reel/Frame 028149/0521 →