Surface mount package and method for forming multi-chip microsensor device
View Patent ↗A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and readouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.
1. A method for manufacturing a surface mount package for a multi-chip device comprising the steps of:
forming a planar leadframe having first and second die pads, corresponding contacts and leadouts and a trimable marginal edge temporarily securing the die pads, contacts and leadouts together in a planar structure;
mounting an ASIC chip to the first die pad of the leadframe and wirebonding the chip to corresponding contacts on the leadframe;
forming a body by over molding the ASIC and a portion of the leadframe to isolate the ASIC chip from environmental effects, and forming a chamber in the body adjacent to the second die pad having an opening for receiving a cover;
mounting a sensor chip to the second die pad of the leadframe and wirebonding the sensor chip to the corresponding contacts on the leadframe;
covering the opening with an apertured cover;
sealing the cover therein; and
generating a first plane and a second plane by deforming the leadframe, wherein the first die pad is positioned on and adjacent to the first plane, wherein the second die pad is positioned on and adjacent to the second plane, and wherein the second plane is offset from the first plane.
2. The method according to claim 1 wherein the first plane is parallel to the second plane.
3. The method according to claim 1 further comprising the step of depositing a protective gel in the recess over the sensor chip.
4. The method according to claim 1 further including singulating the device by trimming a tiebar in the leadframe after molding the body.