Wave antenna wireless communication device and method
View Patent ↗A wireless communication device coupled to a wave antenna that provides greater increased durability and impedance matching. The wave antenna is a conductor that is curved in alternating sections. The wireless communication device is coupled to the wave antenna to provide wireless communication. The wireless communication device and wave antenna may be placed on objects, goods, or other articles of manufacture that are subject to forces such that the wave antenna may be stretched or compressed during the manufacture and/or use of such object, good or article of manufacture. The wave antenna, because of its curved structure, is capable of stretching and compressing more easily than other structures, reducing the wireless communication device's susceptibility to damage or breakage that might render the wireless communication device coupled to the wave antenna unable to properly communicate information wirelessly.
1. A method of manufacturing a sinusoidal-shaped wave antenna, comprising:
passing a conducting material through a first cog and a second cog each having a sinusoidal-shaped periphery and placed in proximity to each other, wherein said sinusoidal-shaped peripheries of said first and second cogs substantially interlock with each other as said first and second cogs rotate; and
placing alternating curves in said conducting material when said conducting material is passed through said first and said second cogs.
2. A method of manufacturing a wireless communication device that is coupled to a sinusoidal-shaped wave antenna, comprising:
passing a conducting material through a first cog and a second cog each having a sinusoidal-shaped periphery and placed in proximity to each other, wherein said sinusoidal-shaped peripheries of said first and second cogs substantially interlock with each other as said first and second cogs rotate;
placing alternating curves in said conducting material when said conducting material passes through said first and second cogs to form a conducting material having a plurality of peaks separated by valleys; and
electrically connecting a wireless communication device across opposing sides of one of said plurality of peaks.
3. The method of claim 2 , wherein said electrically connecting the wireless communication device comprises soldering, the method further comprising tinning each side of said one of said plurality of peaks before said soldering.
4. The method of claim 3 , further comprising:
re-flow soldering said wireless communication device with hot gas;
cleaning sway excess solder; and
removing a short formed across said wireless communication device by said one of said plurality of peaks;
wherein said re-flow soldering, cleaning away, and removing a short are performed after said soldering.
5. The method of claim 2 , wherein said electrically connecting the wireless communication device comprises soldering, the method further comprising re-flow soldering said wireless communication device with hot gas after said soldering.
6. The method of claim 2 , wherein said electrically connecting the wireless communication device comprises soldering, the method further comprising cleaning away excess solder after said soldering.
7. The method of claim 2 , further comprising removing a short formed across said wireless communication device by said one of said plurality of peaks.
8. The method of claim 2 , further comprising encapsulating said wireless communication device after said wireless communication device has been electrically connected to said one of said plurality of peaks.
9. The method of claim 2 , further comprising electrically connecting multiple wireless communication devices to said conducting material, each said wireless communication device being individually connected across the sides of a peak in said conducting material.
10. The method of claim 9 , further comprising winding said conducting material with said wireless communication devices attached thereto onto a reel.
11. The method of claim 10 , further comprising cutting said conducting material between said wireless communication devices to separate the wireless communication devices.
12. The method of claim 2 , further comprising attaching said wireless communication device to a tire.
13. A method of manufacturing a semicircle-shaped wave antenna, comprising
passing a conducting material through a first cog and a second cog each having a semicircle-shaped periphery and placed in proximity to each other wherein said semicircle-shaped peripheries of said first and second cogs substantially interlock with each other as said first and second cogs rotate; and
placing alternating curves in said conducting material when said conducting material is passed through said first and second cogs.
14. A method of manufacturing a wireless communication device that is coupled to a semicircle-shaped wave antenna, comprising:
passing a conducting material through a first cog and a second cog each having a semicircle-shaped periphery and placed in proximity to each other wherein said semicircle-shaped peripheries of said first and second cogs substantially interlock with each other as said first and second cogs rotate;
placing alternating curves in said conducting material when said conducting material passes through said first and second cogs to form a conducting material having a plurality of peaks separated by valleys; and
electrically connecting a wireless communication device across opposing sides of one of said plurality of peaks.
15. The method of claim 14 , wherein said electrically connecting the wireless communication device comprises soldering, the method further comprising tinning each side of said one of said plurality of peaks before said soldering.
16. The method of claim 14 , further comprising:
reflow-soldering said wireless communication device with hot gas;
cleaning away excess solder; and
removing a short formed across said wireless communication device by said one of said plurality of peaks;
wherein said re-flow soldering, cleaning away, and removing a short are performed after said soldering.
17. The method of claim 14 , wherein said electrically connecting the wireless communication device comprises soldering, the method further comprising re-flow soldering said wireless communication device with hot gas after said soldering.
18. The method of claim 14 , wherein said electrically connecting the wireless communication device comprises soldering, the method further comprising cleaning away excess solder after said soldering.
19. The method of claim 14 , further comprising removing a short formed across said wireless communication device by said one of said plurality of peaks.
20. The method of claim 14 , further comprising encapsulating said wireless communication device after said wireless communication device has been electrically connected to said one of said plurality of peaks.
21. The method of claim 14 , further comprising electrically connecting multiple wireless communication devices to said conducting material, each said wireless communication device being individually connected across the sides of a peak in said conducting material.
22. The method of claim 21 , further comprising winding said conducting material with said wireless communication devices attached thereto onto a reel.
23. The method of claim 22 , further comprising cutting said conducting material between said wireless communication devices to separate the wireless communication devices.
24. The method of claim 14 , further comprising attaching said wireless communication device to a tire.