Tantalum sputtering target and method of fabrication
View Patent ↗A process is described for processing metal which includes clock rolling a metal plate until the desired thickness is achieved to form a rolled plate. Sputtering targets and other metal articles are further described.
1. A tantalum metal plate that is circular in shape and having a rolling plane and a thickness of 0.080 to 1.5 inch, wherein said tantalum metal plate is isotropic in said rolling plane and deforms isotropically in any direction within said rolling plane and said tantalum metal plate has a crystallographic texture throughout said thickness wherein said crystallographic texture has a pole figure with an axial symmetrical texture with an axis normal to said rolling plane, wherein said axis has a primary axial <111> crystallographic texture, with <110> texture and <100> texture poles that are randomly distributed or have a symmetrical texture around said axis, or said axis has a primary axial <100> crystallographic texture, with <110> texture and <111> texture poles that are randomly distributed or have a symmetrical texture around said axis, and said tantalum metal plate has a percent texture banding area of less than 0.5% with respect to overall area and volume of said tantalum metal plate that is inconsistent or non-uniform with respect to the primary texture present in said tantalum metal plate, and said tantalum metal plate has a purity of at least 99.99% Ta and an average grain size of 150 microns or less.
2. The tantalum metal plate of claim 1 having the pole figures of FIG. 3 .
3. The tantalum metal plate of claim 1 , wherein said axis is a primary axial <111> crystallographic texture, with <110> texture and <100> texture poles that are randomly distributed or have a symmetrical texture around said axis.
4. The tantalum metal plate of claim 1 , wherein said axis is a primary axial <100> crystallographic texture, with <110> texture and <111> texture poles that are randomly distributed or have a symmetrical texture around said axis.
5. The tantalum metal plate of claim 1 , wherein said percent texture banding area is with respect to (100) texture banding.
6. The tantalum metal plate of claim 1 , wherein said metal article has a uniform mixed (111):(100) texture.
7. The tantalum metal plate of claim 1 , wherein said tantalum metal plate is a sputter target that is bonded to a backing plate.
8. The tantalum metal plate of claim 1 , wherein percent banding area is from 0.1 to less than 0.5%.
9. The tantalum metal plate of claim 1 , wherein percent banding area is from 0.1 to 0.4%.
10. The tantalum metal plate of claim 1 , wherein said percent banding area is from 0.1 to 0.25%.
11. The tantalum metal plate of claim 1 , wherein said tantalum metal plate is a sputter target disk.
12. The tantalum metal plate of claim 11 , further comprising a backing plate attached to said sputter target disk.
13. The tantalum metal plate of claim 1 , wherein said primary texture is a primary (111) texture.
14. The tantalum metal plate of claim 13 , wherein said tantalum metal plate is a sputter target blank.