Semiconductor integrated circuit device
View Patent ↗A semiconductor integrated circuit device has a semiconductor substrate, an interlayer insulating film including SiOF films formed on a main surface of the semiconductor substrate, a wiring groove formed by dry etching of the interlayer insulating film, and a Cu wiring buried in the wiring groove by a Damascene method, wherein a silicon oxynitride film is provided between a silicon nitride film serving as an etching stopper layer for the dry etching and the SiOF film, so that free F generated in the SiOF film is trapped with the silicon oxynitride film.
1. A semiconductor integrated circuit device comprising a semiconductor substrate, a first insulating film formed on a main surface of said semiconductor substrate and made of fluorine-containing silicon oxide, a first wiring formed inside said first insulating film, a second insulating film formed over said first insulating film and said first wiring, respectively, and made of silicon nitride, and a third insulating film interposed between said first insulating film and said second insulating film and made of nitrogen-containing silicon oxide, wherein the third insulating film is in contact with both said first insulating film and said second insulating film.
2. A semiconductor integrated circuit device according to claim 1 , wherein said third insulating film has a ratio of silicon to oxygen and nitrogen which is stoichiometrically in excess.
3. A semiconductor integrated circuit device according to claim 1 , wherein said third insulating film has a nitrogen concentration of 5 atom percent or below.
4. A semiconductor integrated circuit device according to claim 1 , wherein said third insulating film has a thickness of 50 nm or below.
5. A semiconductor integrated circuit device according to claim 1 , wherein said first wiring is made of a conductive layer containing copper as a main component.
6. A semiconductor integrated circuit device according to claim 1 , further comprising, over said second insulating film, an interlayer insulating film including a fourth insulating film made of fluorine-containing silicon oxide, a fifth insulating film made of silicon nitride, and a sixth insulating film interposed between said fourth insulating film and said fifth insulating film and made of nitrogen-containing silicon oxide, and a second wiring provided inside said interlayer insulating film and electrically connected to said first wiring, wherein said first wiring of a region except for a connection with said second wiring is covered on the surface thereof with a seventh insulating film.
7. A semiconductor integrated circuit device according to claim 6 , further comprising an eighth insulating film interposed between said second insulating film and said fourth insulating film and made of nitrogen-containing silicon oxide.
8. A semiconductor integrated circuit device comprising a semiconductor substrate, a first insulating film formed on a main surface of said semiconductor substrate and made of fluorine-containing silicon oxide, a first wiring formed inside said first insulating film, a second insulating film formed over said first insulating film and said first wiring, respectively; and made of Sic or SiCN, and a third insulating film interposed between said first insulating film and said second insulating film and made of nitrogen-containing silicon oxide, wherein the third insulating film is in contact with both said first insulating film and said second insulating film.
9. A semiconductor integrated circuit device according to claim 8 , wherein said third insulating film has a ratio of silicon to oxygen and nitrogen which is stoichiometrically in excess.
10. A semiconductor integrated circuit device according to claim 8 , wherein said third insulating film has a nitrogen concentration of 5 atom percent or below.
11. A semiconductor integrated circuit device according to claim 8 , wherein said third insulating film has a thickness of 50 nm or below.
12. A semiconductor integrated circuit device according to claim 8 , wherein said first wiring is made of a conductive layer containing copper as a main component.
13. A semiconductor integrated circuit device according to claim 8 , further comprising, over said second insulating film, an interlayer insulating film including a fourth insulating film made of fluorine-containing silicon oxide, a fifth insulating film made of SiC or SiCN, and a sixth insulating film interposed between said fourth insulating film and said fifth insulating film and made of nitrogen-containing silicon oxide, and a second wiring provided inside said interlayer insulating film and electrically connected to said first wiring, wherein said first wiring of a region except for a connection with said second wiring is covered on the surface thereof with a seventh insulating film made of SiC or SiCN.
14. A semiconductor integrated circuit device according to claim 13 , further comprising an eighth insulating film interposed between said second insulating film and said fourth insulating film and made of SiC or SiCN.