Process for enhancing dye polymer recording yields by pre-scanning coated substrate for defects
View Patent ↗A method for enhancing recording yields by monitoring dye polymer formation on a glass substrate is provided. After the glass substrate is coated with a dye polymer layer and before pits are formed on the dye-polymer coated glass, the dye polymer coated glass substrate is scanned to detect defects. The dye-polymer coated glass is discarded on the one hand if the defects detected through the scanning are at or above an unacceptable threshold level, and on the other hand data is written on the dye-polymer coated glass if the defects detected through the scanning are below the unacceptable threshold level.
1. A method for enhancing yields in an optical recording media manufacturing process, by monitoring dye polymer formation on glass, said method comprising the steps of:
(a) coating a glass substrate with a dye polymer layer;
(b) scanning the dye polymer coated glass substrate to detect defects;
(c) discarding the dye-polymer coated glass without data written on the dye-polymer coated glass if the defects detected in step (b) are at or above an unacceptable threshold level; and
(d) writing data on the dye polymer coated glass if the defects detected in step (b) are below the unacceptable threshold level and utilizing the dye polymer coated glass bearing the data in said optical recording media manufacturing process,
wherein said scanning in step (b) occurs prior to writing to the dye polymer coated glass, and
wherein the scanning in step (b) does not cause marks or pits to be formed in the dye polymer layer, and does not change physical properties of the dye polymer coated substrate.
2. The method of claim 1 further comprising the step of:
determining between steps (b) and (c) a size of the defects detected in step (b),
wherein the dye-polymer coated glass is discarded in step (c) without data written on the dye-polymer coated glass if the size of the defects is greater than or equal to a predetermined unacceptable size threshold.
3. The method of claim 2 , wherein the unacceptable size threshold is selected by an operator prior to step (b).
4. A method for an optical recording media manufacturing process, said method comprising the steps of:
(a) coating a glass substrate with a dye polymer layer;
(b) scanning the dye-polymer coated glass substrate to detect defects;
(c) discarding the dye-polymer coated glass without data written on the dye-polymer coated glass if the defects detected in step (b) are at or above an unacceptable threshold level;
(d) writing data on the dye polymer coated glass if the defects detected in step (b) are below the unacceptable threshold level, and utilizing the dye polymer coated glass bearing the data in said optical recording media manufacturing process; and
(e) determining between steps (b) and (c) a percentage of a surface of the dye polymer layer occupied by the defects detected in step (b),
wherein said scanning in step (b) occurs prior to writing to the dye polymer coated glass, and
wherein the dye-polymer coated glass is discarded in step (c) without data written on the dye-polymer coated glass if the percentage of the surface of the dye polymer layer occupied by the defects is greater than or equal to a predetermined unacceptable percentage threshold.
5. The method of claim 4 , wherein the unacceptable percentage threshold is selected by an operator prior to step (b).
6. The method of claim 1 further comprising the steps of:
(e) scanning the dye-polymer coated glass to determine thickness at a plurality of locations of the dye polymer layer;
(f) comparing the thicknesses determined in step (e) to a predetermined expected thickness; and
(g) discarding the dye-polymer coated glass without data written on the dye-polymer coated glass if a percentage of the thicknesses determined in step (e) not within the preprogrammed standard is greater than or equal to a predetermined unacceptable percentage threshold.
7. The method of claim 6 , wherein the predetermined expected thickness is selected by an operator prior to step (f).
8. The method of claim 6 , wherein the acceptable range is selected by an operator prior to step (g).
9. The method of claim 6 , wherein the unacceptable percentage threshold is selected by an operator prior to step (g).
10. A method for an optical recording media manufacturing process, said method comprising the steps of:
(a) coating a glass substrate with a dye polymer layer;
(b) scanning the dye polymer coated glass substrate to detect defects;
(c) discarding the dye-polymer coated glass without data written on the dye-polymer coated glass if the defects detected in step (b) are at or above an unacceptable threshold level;
(d) writing data on the dye polymer coated glass if the defects detected in step (b) are below the unacceptable threshold level and utilizing the dye polymer coated glass bearing the data in said optical recording media manufacturing process;
(e) applying a modulated light beam to the dye polymer layer on the glass substrate to form pits on the dye polymer layer; and
(f) testing the dye-polymer coated glass for defects a second time, after the pits are formed on the dye-polymer layer in step (e),
wherein said scanning in step (b) occurs prior to writing to the dye polymer coated glass.
11. The method of claim 1 , wherein the unacceptable threshold level is selected by an operator prior to step (c).
12. The method of claim 1 further comprising the step of:
baking the dye polymer coated substrate after step (a) and before step (b).
13. The method of claim 1 , wherein said steps (a) through (c) are integrated in an automated mastering process.
14. The method of claim 1 further comprising the step of:
transporting the substrate after step (c) and before step (d) to a laser beam recorder if the defects detected in step (b) are not at or above the unacceptable threshold level,
wherein the data is written by the laser beam recorder on the dye polymer coated glass in step (d).
15. The method of claim 1 , further comprising the steps of:
(e) applying a modulated laser beam to the dye polymer layer to cut pits in the dye polymer layer
(f) checking the quality of the pits cut in step (e), and
(g) adjusting the application of the modulated laser beam according to the result of step (f) to enhance the quality of subsequently cut pits, wherein
step (f) is immediately performed in real time as step (e) is performed.
16. The method of claim 1 , further comprising the step of baking the dye polymer coated substrate after step (b) and before step (d).
17. The method of claim 16 , wherein step (c) is performed before the baking step.
18. The method of claim 10 , wherein step (f) is performed immediately and in real time as step (e) is performed.