Method of forming an electronic pressure sensitive transducer on a printed circuit board
View Patent ↗The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
1. A method of forming an electronic pressure sensitive transducer on a printed circuit board, the printed circuit board accepting a plurality of electronic components for processing signals generated by the pressure sensitive transducer, the method comprising:
forming a first plurality of conductive traces on the printed circuit board to form a contact area;
forming a pedestal on the printed circuit board substantially around the contact area, with a second plurality of conductive traces the second traces formed on the printed circuit board in the shape of the pedestal and covered with a non-conducting material;
depositing at least one resistive layer on an inner side of a flexible substrate; and
assembling the flexible substrate on the printed circuit board such that the flexible substrate resistive layer is facing the printed circuit board conductive traces, the flexible substrate held to the printed circuit board by an adhesive substantially surrounding at least a portion of the contact area and contacting the pedestal.
2. The method of forming an electronic pressure sensitive transducer on a printed circuit board as in claim 1 wherein at least one resistive layer comprises resistive ink.
3. The method of forming an electronic pressure sensitive transducer on a printed circuit board as in claim 1 wherein assembling comprises screen printing the adhesive on at least one of the flexible substrate and the printed circuit board.
4. The method of forming an electronic pressure sensitive transducer on a printed circuit board as in claim 1 wherein the traces forming the pedestal are formed in the same process as the traces forming the contact area.
5. The method of forming an electronic pressure sensitive transducer on a printed circuit board as in claim 1 wherein the first plurality of conductive traces are formed as a plurality of sets of zonal traces, each set of zonal traces interconnected within a zone of the contact area, and as an interconnected set of common traces extending into each zone.
6. The method of forming an electronic pressure sensitive transducer on a printed circuit board as in claim 1 wherein forming a first plurality of conductive traces comprises depositing an oxidation preventing conductive material over copper traces.
7. The method of forming an electronic pressure sensitive transducer on a printed circuit board as in claim 1 wherein forming a first plurality of conductive traces comprises screen printing a carbon ink.