IP Library Granted Patent US 7,325,591
Granted Patent B2
US 7,325,591 · App. 11/060,419 · Granted Feb 5, 2008

Liquid-cooling heat dissipation apparatus

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Quick Facts
Patent No.
US 7,325,591
App. No.
11/060,419
Granted
Feb 5, 2008
Kind
B2
Abstract

A liquid-cooling heat dissipation apparatus includes a casing, a first compartment defined in the casing for assembling a liquid driving unit, a cooling plate module on bottom of the casing, a second compartment defined between an inner space of the casing and the cooling plate module and containing a cooling liquid therein. At least one liquid inlet and liquid outlet are defined on the casing and communicated through the second compartment. Therefore, the liquid driving unit and the cooling plate module can be advantageously integrated into the casing while the duct is reduced to achieve compact space. Moreover, the overall structure achieves liquid storing, circulating and heat conveying function.

Claims (16)

1. A liquid-cooling heat dissipation apparatus used to convey heat from a heat source, comprising:

a casing comprising a first compartment defined therein for a liquid driving unit to be mounted inside, a cooling plate module arranged on bottom of the casing, a second compartment defined between an inner space of the casing and the cooling plate module and containing a cooling liquid, at least one liquid inlet and liquid outlet being defined on the casing, and

wherein the liquid driving unit comprises a coil stage, an upper cover, an impeller stage and a lower cover, at least one runner being defined on the lower cover and corresponding to the liquid inlet, and

wherein the cooling plate module comprises a bottom plate fixed to bottom of the casing and a plurality of heat-dissipating fins provided atop the bottom plate,

whereby the cooling liquid is circulated when the liquid driving unit operates.

2. The liquid-cooling heat dissipation apparatus as in claim 1 , wherein fixing units are provided on peripheral of the cooling plate module and assemble the cooling plate module with a heat emitting device, wherein a bottom of the cooling plate module is in close contact with the heat emitting device.

3. The liquid-cooling heat dissipation apparatus as in claim 1 , wherein a frame is assembled to a bottom of the cooling plate module, and the frame keeps the bottom of the cooling plate module in close contact with the heat emitting device.

4. The liquid-cooling heat dissipation apparatus as in claim 1 , wherein the at least one liquid inlet and liquid outlet are communicated through a plurality of ducts with a liquid cooling array.

5. The liquid-cooling heat dissipation apparatus as in claim 1 , further comprising at least one sealing pad placed between the casing and the cooling plate module.

6. A liquid-cooling heat dissipation apparatus used to convey heat from a heat source, comprising:

a casing comprising a first compartment, a liquid driving unit, a cooling plate module on bottom of the casing, a second compartment defined between an inner space of the casing and the cooling plate module and containing a cooling liquid, at least one liquid inlet and liquid outlet being defined on the casing and communicated through the second compartment, whereby the cooling liquid is circulated when the liquid driving unit operates, and

wherein a frame is assembled to a bottom of the cooling plate module, and the frame keeps the bottom of the cooling plate module in close contact with the heat emitting device.

7. The liquid-cooling heat dissipation apparatus as in claim 6 , wherein fixing units are provided on peripheral of the frame and assemble the cooling plate module with a heat emitting device.

8. The liquid-cooling heat dissipation apparatus as in claim 6 , wherein the at least one liquid inlet and liquid outlet are communicated through a plurality of ducts with a liquid cooling array.

9. The liquid-cooling heat dissipation apparatus as in claim 6 , further comprising at least one sealing pad placed between the casing and the cooling plate module.

10. The liquid-cooling heat dissipation apparatus as in claim 6 , wherein the cooling plate module comprises a plurality of heat-dissipating fins on top face thereof.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2012
From: COOLER MASTER CO., LTD.
To: CHEMTRON RESEARCH LLC
Reel/Frame 027567/0332 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYANCE EXECUTIVE DATE PREVIOUSLY RECORDED ON REEL 016313 FRAME 0369. ASSIGNOR(S) HEREBY CONFIRMS THE DATE 01/19/2004 IS INCORRECT AND SHOULD BE 01/19/2005. Recorded Nov 17, 2011
From: DUAN, QIANG-FEI; LO, LIEH-FENG
To: COOLER MASTER CO., LTD.
Reel/Frame 027248/0425 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2005
From: DUAN, QIANG-FEI; JIANG, TAI-YANG
To: COOLER MASTER CO., LTD.
Reel/Frame 016313/0369 →