IP Library Granted Patent US 7,663,289
Granted Patent B1
US 7,663,289 · App. 11/061,145 · Granted Feb 16, 2010

Centipede actuator motion stage

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Quick Facts
Patent No.
US 7,663,289
App. No.
11/061,145
Granted
Feb 16, 2010
Kind
B1
Abstract

A micro electromechanical actuator has movable flaps formed on a base plate. The flaps are detached from the base plate on the ends and along one side, with the opposite side being partially attached to the base plate by flexures. The flaps can be moved upward, rotating or twisting along the axis of the flexure so that a one side contacts a movable element first, followed by the opposite side. As a result, the movable element is moved laterally with respect to the flaps. Movement of the flaps can be by application of a voltage to the flaps, followed by removal of the voltage to return the flaps to their original position. The cycle can continue to move the movable element the desired amount.

Claims (17)

1. A method of moving an element having a planar lower surface using a micro electro-mechanical actuator, the method comprising:

providing a planar substrate having a planar upper surface and a planar moveable flap formed therein,

suspending the element above the substrate such that the lower surface of the element is disposed parallel to the upper surface of the substrate and is spaced apart therefrom by a constant distance;

bringing a first portion of the planar movable flap into contact with the lower surface of the element; and,

bringing a second portion of the flap into contact with the lower surface of the element such that the second portion of the flap is disposed against and substantially parallel to the lower surface of the element and causes the element to move laterally relative to the substrate; wherein

the bringing of the first and second portions of the flap into contact with the surface are respectively effected through first and second electrostatic forces acting between the flap and the element, and

the field strength of the second electrostatic force is greater than that of the first electrostatic force.

2. The method of claim 1 , wherein the bringing of the first and second portions of the flap into contact with the surface comprises applying a first voltage to the flap.

3. The method of claim 2 , wherein the bringing of the first and second portions of the flap into contact with the surface further comprises applying a second voltage to the surface, the second voltage being different than the first voltage.

4. The method of claim 3 , wherein the second voltage comprises approximately 0 volts.

5. The method of claim 1 , further comprising moving the flap away from the surface.

6. The method of claim 5 , wherein the moving comprises reducing the voltage on the flap to approximately 0 volts.

7. The method of claim 5 , further comprising repeating the bringing and moving to effectuate continued movement.

8. The method of claim 5 , further comprising alternating the bringing and moving between two sets of flaps.

9. The method of claim 1 , wherein the first portion of the flap is more freely movable than the second portion.

10. The method of claim 1 , further comprising suspending the element relative to the flap such that the element is substantially constrained against all but lateral movement.

11. The method of claim 10 , wherein the suspending of the element relative to the flap comprises suspending the element by one or more flexures.

Assignments (10)
SECURITY INTEREST Recorded May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.; ADEIA SEMICONDUCTOR INC.; ADEIA SEMICONDUCTOR SOLUTIONS LLC; ADEIA SEMICONDUCTOR TECHNOLOGIES LLC; ADEIA SOLUTIONS LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
CHANGE OF NAME Recorded Aug 23, 2011
From: TESSERA MEMS TECHNOLOGIES, INC.
To: DIGITALOPTICS CORPORATION MEMS
Reel/Frame 026794/0897 →
CHANGE OF NAME Recorded Sep 24, 2010
From: SIIMPEL CORPORATION
To: TESSERA MEMS TECHNOLOGIES, INC.
Reel/Frame 025039/0193 →
RELEASE OF SECURITY INTEREST Recorded May 7, 2010
From: SCALE VENTURE PARTNERS II, L.P.
To: SIIMPEL CORPORATION
Reel/Frame 024351/0353 →
PATENT SECURITY AGREEMENT Recorded Mar 31, 2010
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P.
Reel/Frame 024170/0078 →
PATENT SECURITY AGREEMENT Recorded Nov 16, 2009
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P., AS COLLATERAL AGENT
Reel/Frame 023519/0715 →
CHANGE OF NAME Recorded Jul 1, 2005
From: SIWAVE, INC.
To: SLIMPEL CORPORATION
Reel/Frame 016463/0205 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2005
From: GUTIERREZ, ROMAN C.
To: SIWAVE, INC.
Reel/Frame 015899/0430 →