High density connector
View Patent ↗An improved and more flexible connector assembly and method are provided for connecting an electrical component to a substrate, such as a printed circuit board (PCB), by attaching an electrical component having ball or column grid array solder portions to corresponding electrical contact surfaces of a second connector half, mating first and second connector halves and attaching the first connector half having ball or column grid array solder portions to corresponding electrical contact surfaces of the substrate. The first and second connector halves may be electrically connected to each other via conventional mating techniques. When mated, electrical communication is achieved between corresponding portions of the first and second connector halves. Effects of CTE mismatch are minimized by providing the first and second connector halves between the electrical component and substrate.
1. An electrical connector comprising:
a connector body having a first surface, a second surface, and a passageway defined between said first surface and said second surface; and
an electrical contact positioned in said passageway, said electrical contact having a first end and a second end, said first end lacking solder mass sufficient to reflow and said second end lacking solder mass sufficient to reflow,
wherein said first end is adapted to receive a solder mass attached to an electrical component, and said second end is adapted to be received by a mating connector having a solder mass for reflow connection to contacts a substrate,
wherein physical connection between the second end and the mating connector may be readily made and broken repeatedly independent of auxiliary fastening of the connector body to the substrate.
2. The electrical connector of claim 1 , wherein said first end is situated substantially inside said passageway.
3. The electrical connector of claim 1 , wherein said first end is adapted to receive a ball-type contact from the component.
4. The electrical connector of claim 1 , wherein said body comprises a plurality of passageways defined between said first surface and said second surface, and further comprising a plurality of electrical contacts disposed in said plurality of passageways.
5. The electrical connector of claim 4 , wherein each of said plurality of electrical contacts lacks solder sufficient for reflow.
6. The electrical connector of claim 1 , wherein said component is an integrated circuit.