Optically improved CMOS imaging sensor structure to lower imaging lens requirements
View Patent ↗A sensor die that lowers the lens requirements by the use of a variable thickness distribution over the sensor die. The sensing portion of the sensor die has a different number of layers than the non-sensing portion of the sensor die. By reducing the thickness of each layer and/or eliminating one or more unnecessary layers in the sensing portion, the thickness of the sensing portion is reduced to lower the amount of stray light and allow an increase in chief ray angle as well as a decrease in the F-number of the imaging system coupled to the sensor die without compromising the image quality of the sensor die. Also, the thickness reduction provides the design engineers with extra allowance in handling the chief ray angle and F-number for a given lens requirements.
1. A sensor die comprising:
a sensing portion including a plurality of pixels, each of the plurality of pixels having a first set of layers and a microlens;
a non-sensing portion around an outside border of the plurality of pixels having a second set of layers, the second set of layers having a different number of layers than the first set of layers and wherein a thickness of the second set of layers is larger than a thickness of the first set of layers to reduce size of the sensor die, wherein the sensing and non-sensing portions are formed on a substrate having a plurality of passive components; and
wherein the first set of layers includes:
a photodiode partially embedded on the substrate;
a first insulating layer on top of the photodiode and the substrate;
a plurality of metal layers on top of the first insulating layer, the photodiode and the plurality of passive components coupled to at least one of the plurality of metal layers;
a plurality of middle insulating layers, each of the plurality of metal layers sandwiched by corresponding two of the plurality of middle insulating layers;
a passivation layer on top of the plurality of middle insulating layers;
a color filter; and
a planar layer on top of the color filter,
wherein an optical axis of the microlens and an optical axis of the color filter are shifted with respect to an optical axis of the photodiode and wherein the microlens is configured to direct incoming light to the photodiode.
2. A sensor die formed on a substrate having a plurality of passive components, comprising:
a sensing portion including a plurality of pixels, each of the plurality of pixels having a microlens and a first set of layers that comprises:
a photodiode partially embedded on the substrate;
a first insulating layer on top of the photodiode and the substrate;
a plurality of metal layers on top of the first insulating layer, the photodiode and the plurality of passive components connected to at least one of the plurality of metal layers;
plurality of middle insulating layers, each of the plurality of metal layers sandwiched by corresponding two of the plurality of middle insulating layers;
a passivation layer on top of the plurality of middle insulating layers;
a color filter; and
a planar layer on top of the color filter; and
a non-sensing portion around an outside border of the plurality of pixels having a second set of layers, the second set of layers having a different number of layers than the first set of layers and wherein a total thickness of the second set of layers is larger than a total thickness of the first set of layers to reduce size of the sensor die.
3. The sensor die of claim 2 , wherein an optical axis of the microlens and an optical axis of the color filter are shifted with respect to an optical axis of the photodiode.
4. The sensor die of claim 2 , wherein the second set of layers includes at least one more layer than the first set of layers and wherein the at least one more layer is a metal layer, an insulating layer, or any combination thereof.
5. The sensor die of claim 2 wherein thickness of the first and second sets of layers is about 4 microns.
6. The sensor die of claim 2 , wherein the device is a digital camera or a cellular phone with an imaging capability.
7. The sensor die of claim 2 , wherein the color filter passes light of one color selected from the group consisting of red, green and blue.
8. The sensor die of claim 1 , wherein the second set of layers includes at least one more layer than the first set of layers and wherein the at least one more layer is a metal layer, an insulating layer, or any combination thereof.
9. The sensor die of claim 1 , wherein the color filter passes light of one color selected from the group consisting of red, green and blue.