IP Library Granted Patent US 7,227,231
Granted Patent B2
US 7,227,231 · App. 11/066,033 · Granted Jun 5, 2007

Semiconductor integrated circuit device

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Quick Facts
Patent No.
US 7,227,231
App. No.
11/066,033
Granted
Jun 5, 2007
Kind
B2
Abstract

A semiconductor integrated circuit device has a first MOS transistor and a second MOS transistor. The first MOS transistor has a first source, a first gate electrode, and a first wiring metal connected to the first source and overlapping the first gate electrode. The second MOS transistor has a second source, a second gate electrode, and a second wiring metal connected to the second source. The first wiring metal of the first MOS transistor and the second wiring metal are positioned so that they do not overlap the second gate electrode.

Claims (10)

1. A semiconductor integrated circuit device comprising:

a first MOS transistor having a first source, a first gate electrode, and a first wiring metal connected to the first source and having a plurality of spaced-apart portions overlapping the first gate electrode of the first MOS transistor; and

a second MOS transistor having a second source, a second gate electrode, and a second wiring metal connected to the second source, the first wiring metal of the first MOS transistor and the second wiring metal being positioned so that they do not overlap the second gate electrode.

2. A semiconductor integrated circuit device according to claim 1 ; wherein the spaced-apart portions of the first wiring metal are spaced-apart in a channel width direction of the first MOS transistor.

3. A semiconductor integrated circuit device according to claim 1 ; wherein the spaced-apart portions of the wiring metal form a combshaped structure.

4. A semiconductor integrated circuit device comprising:

a first MOS transistor having a first source wiring metal, a first drain wiring metal, and a first gate electrode, the first source wiring metal having a plurality of spaced-apart portions overlapping the first gate electrode; and

a second MOS transistor having a second source wiring metal, a second drain wiring metal, and a second gate electrode, the first and second source wiring metals and the first and second drain wiring metals being positioned so that they do not overlap the second gate electrode.

5. A semiconductor circuit device according to claim 4 ; wherein the spaced-apart portions of the first source wiring metal are spaced-apart in a channel width direction of the first MOS transistor.

6. A semiconductor circuit device according to claim 4 ; wherein the spaced-apart portions of the first source wiring metal form a comb-shaped structure.

Assignments (3)
CHANGE OF ADDRESS Recorded Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →
CHANGE OF NAME Recorded Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2016
From: SEIKO INSTRUMENTS INC.
To: SII SEMICONDUCTOR CORPORATION
Reel/Frame 038058/0892 →