Methods for manufacturing optical modules using lead frame connectors

1. A method of manufacturing an optical transceiver module, the method comprising:

positioning a lead frame connector for attachment to an optical sub-assembly of the optical transceiver module, the lead frame connector comprising a plurality of electrically isolated conductors disposed within an electrically insulating case having a first part separated from a second part, each of the plurality of conductors forming an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from and movable relative to the second part;

connecting the plurality of electrical contacts to corresponding leads of the optical sub-assembly to obtain a combined structure that includes the lead frame connector and the optical sub-assembly; and

connecting the plurality of contact points to corresponding conductive structures on a printed circuit board of the optical transceiver module to electrically connect the optical sub-assembly to the printed circuit board, wherein connecting the plurality of contact points includes:

bending the conductors at a first location between the first part and the second part; and

bending the conductors at a second location adjacent the contact points to align the contact points with the conductive structures;

wherein the first location is different from the second location.

2. The method as defined in claim 1 , wherein connecting the plurality of electrical contacts comprises:

passing each of the leads of the optical sub-assembly through a hole in the corresponding electrical contact; and

soldering the leads to the corresponding electrical contacts.

3. The method as defined in claim 2 , wherein soldering the leads to the corresponding electrical contacts is performed by applying the solder to the electrical contacts at a side of the lead frame connector that is opposite a side that is adjacent to the optical sub-assembly.

4. The method as defined in claim 1 , wherein connecting the plurality of contact points of the lead frame connector to the corresponding conductive structures on a printed circuit board comprises:

placing the contact points of the lead frame connector in contact with the corresponding conductive structures; and

soldering the contact points to the conductive structures.

5. The method as defined in claim 1 , wherein connecting the plurality of contact points of the lead frame connector to the corresponding conductive structures on a printed circuit board comprises:

placing the contact points of the lead frame connector in contact with the corresponding conductive structures; and

connecting the contact points to the conductive structures using one of a hand soldering process, a hot bar process, an infrared reflow process, a hot air reflow process and a laser soldering process.

6. The method as defined in claim 1 , wherein said optical sub-assembly is an optical sub-assembly selected from the group consisting of a transmitter optical sub-assembly or a receiver optical sub-assembly.

7. The method as defined in claim 1 , wherein connecting the plurality of electrical contacts to corresponding leads comprises self-aligning of the lead frame connector with respect to the optical sub-assembly as the corresponding leads pass through holes in the electrical contacts.

8. The method as defined in claim 1 , wherein the lead frame connector meets at least a portion of the requirements outlined in the 2002/95/EC Reduction of Hazardous Substances (ROHS) Directive.

9. The method as defined in claim 1 , wherein the lead frame is connected to the printed circuit board without the use of lead solder.