Thermal seal between manifold and nozzle
View Patent ↗A seal is provided between a nozzle and a manifold. The seal provides a melt channel between an outlet of the manifold and a nozzle channel. The seal has higher thermal expansion coefficient than both the nozzle and the manifold to provide an improved seal between the manifold and the nozzle when the injection molding apparatus is at an operating temperature.
1. An injection molding apparatus comprising:
a manifold having a manifold channel for receiving a melt stream of moldable material;
a nozzle having a nozzle channel fluidly connected to the manifold channel and a recess formed in an upper surface; and
a sealing element provided within the nozzle recess, the sealing element including a melt channel for receiving the melt stream from the manifold channel and delivering the melt stream to the nozzle channel, wherein a clearance is provided between the sealing element and the manifold in a cold condition.
2. The injection molding apparatus of claim 1 , wherein the sealing element has a higher thermal expansion coefficient than both the nozzle and the manifold.
3. The injection molding apparatus of claim 2 , wherein the sealing element abuts the manifold at an operating temperature to provide a seal between the sealing element and the manifold.
4. The injection molding apparatus of claim 3 , wherein the sealing element is comprised of copper.
5. The injection molding apparatus of claim 3 , wherein the sealing element is comprised of beryllium copper.
6. The injection molding apparatus of claim 3 , wherein the sealing element is comprised of brass.
7. The injection molding apparatus of claim 1 , wherein the sealing element is a cylindrical sleeve.
8. An injection molding apparatus comprising:
a manifold having a manifold channel, the manifold channel having an inlet for receiving a melt stream of moldable material under pressure and an outlet;
a nozzle having a nozzle channel fluidly connected the outlet of the manifold channel;
a sealing element provided between the nozzle and the manifold, the sealing element including a melt channel for receiving the melt stream from the manifold channel and delivering the melt stream to the nozzle channel, wherein the sealing element has a higher thermal expansion coefficient than both the nozzle and the manifold, and wherein in a cold condition a clearance is provided between the sealing element and an outlet surface of the manifold; and
a mold cavity for receiving the melt stream from the nozzle channel, the nozzle channel communicating with the mold cavity through a mold gate.
9. The injection molding apparatus of claim 8 , wherein in an operating condition the sealing element abuts the outlet surface of the manifold to provide a seal between the sealing element and the manifold.
10. The injection molding apparatus of claim 9 , wherein the sealing element is comprised of copper.
11. The injection molding apparatus of claim 9 , wherein the sealing element is comprised of beryllium copper.
12. The injection molding apparatus of claim 9 , wherein the sealing element is comprised of brass.