Semiconductor interconnect structure
View Patent ↗In a semiconductor device, an interlevel insulating film formed between a Cu interconnection, formed by damascene, and an upper metal interconnection layer on it has a multilayered structure made up of a Cu diffusion preventive insulating layer and another insulating film. The Cu diffusion preventive insulating layer has a multilayered structure made up of not less than two layers. A method for manufacturing the semiconductor device is also disclosed.
1. A semiconductor interconnect structure comprising:
a semiconductor substrate;
a first insulating film directly on said substrate;
a first interconnect through said first insulating film and directly contacting said substrate;
a diffusion preventive insulating layer having a multilayered structure made of not less than two films comprising a first diffusion preventive insulating film disposed directly on said first insulating film and said first interconnect and a second diffusion preventive insulating film disposed directly on and being denser than the first diffusion preventive insulating film;
a second insulating film directly on said diffusion preventive second insulating film; and
a second interconnect through said first and second diffusion preventive insulating films and said second insulating film.
2. The interconnect structure as claimed in claim 1 , wherein said first and second diffusion preventive insulating films are made of the same material as each other.
3. The interconnect structure as claimed in claim 1 , wherein said first and second diffusion preventive insulating films have different thickness from each other.
4. The interconnect structure as claimed in claim 1 , wherein said first diffusion preventive insulating film is an insulating film not containing O.
5. The interconnect structure as claimed in claim 1 , wherein said first diffusion preventive insulating film is one film selected from the group consisting of an SiN film, SiC film, SiCN film and organic film.
6. The interconnect structure as claimed in claim 1 , wherein each of said first and second insulating films is one film selected from the group consisting of an SiO 2 film, porous silica film, organic film, HSQ film and MSQ film.
7. The interconnect structure as claimed in claim 1 , wherein said first and second interconnects are axially aligned.
8. The interconnect structure as claimed in claim 1 , wherein said first diffusion preventive insulating film and a bottom of said second interconnect are coplanar.
9. The interconnect structure as claimed in claim 1 , wherein said bottom of said second interconnect contacts a top of said first interconnect.