IP Library › Granted Patent US 7,196,413
Granted Patent B2
US 7,196,413 · App. 11/069,293 · Granted Mar 27, 2007

Heat dissipation assembly and method for producing the same

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Quick Facts
Patent No.
US 7,196,413
App. No.
11/069,293
Granted
Mar 27, 2007
Kind
B2
Abstract

A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.

Claims (39)

1. A heat dissipation assembly comprising:

a) a heat generator;

b) a heat dissipator integrated with the heat generator;

c) an electrically insulating and thermally conductive sheet configured to integrate the heat generator and the heat dissipator; and

d) a thermally conductive grease layer formed from a thermally conductive grease which is incompatible with the electrically insulating and thermally conductive sheet such that substance migration does not substantially occur between the thermally conductive grease layer and the electrically insulating and thermally conductive sheet, the thermally conductive grease layer provided between at least one of (i) the electrically insulating and thermally conductive sheet and the heat generator and (ii) the electrically insulating and thermally conductive sheet and the heat dissipator.

2. The heat dissipation assembly of claim 1 ,

wherein the thermally conductive grease layer is provided on opposing surfaces of the electrically insulating and thermally conductive sheet.

3. A heat dissipation assembly comprising:

a) a heat generator;

b) a heat dissipator integrated with the heat generator;

c) an electrically insulating and thermally conductive sheet configured to integrate the heat generator and the heat dissipator; and

d) a thermally conductive grease layer formed from a thermally conductive grease which is incompatible with the electrically insulating and thermally conductive sheet such that substance migration does not substantially occur between the thermally conductive grease layer and the electrically insulating and thermally conductive sheet, the thermally conductive grease layer provided between at least one of (i) the electrically insulating and thermally conductive sheet and the heat generator and (ii) the electrically insulating and thermally conductive sheet and the heat dissipator;

wherein the thermally conductive grease comprises one of (i) a perfluoropolyether-based composition, (ii) a C 6 –C 20 alkyl-modified silicone-based composition, and (iii) a fluorinated alkyl-modified silicone-based composition, and the electrically insulating and thermally conductive sheet comprises a methyl vinyl silicone-based rubber.

4. A heat dissipation assembly comprising:

a) a heat generator;

b) a heat dissipator integrated with the heat generator;

c) an electrically insulating and thermally conductive sheet configured to integrate the heat generator and the heat dissipator; and

d) a thermally conductive grease layer formed from a thermally conductive grease which is incompatible with the electrically insulating and thermally conductive sheet such that substance migration does not substantially occur between the thermally conductive grease layer and the electrically insulating and thermally conductive sheet, the thermally conductive grease layer provided between at least one of (i) the electrically insulating and thermally conductive sheet and the heat generator and (ii) the electrically insulating and thermally conductive sheet and the heat dissipator;

wherein the thermally conductive grease comprises one of (i) a dimethylsilicone-based composition, (ii) a perfluoropolyether-based composition, (iii) a C 6 –C 20 alkyl-modified silicone-based composition, and (iv) a methylphenylsilicone-based composition; and the electrically insulating and thermally conductive sheet comprises a fluorosilicone-based rubber.

5. A heat dissipation assembly comprising:

a) a heat generator;

b) a heat dissipator integrated with the heat generator;

c) an electrically insulating and thermally conductive sheet configured to integrate the heat generator and the heat dissipator; and

d) a thermally conductive grease layer formed from a thermally conductive grease which is incompatible with the electrically insulating and thermally conductive sheet such that substance migration does not substantially occur between the thermally conductive grease layer and the electrically insulating and thermally conductive sheet, the thermally conductive grease layer provided between at least one of (i) the electrically insulating and thermally conductive sheet and the heat generator and (ii) the electrically insulating and thermally conductive sheet and the heat dissipator;

wherein the thermally conductive grease includes a mixture of thermally conductive fillers having different particle sizes.

6. The heat dissipation assembly of claim 1 ,

wherein the heat generator is a semiconductor device.

7. A heat dissipation assembly comprising:

a) a heat generator;

b) a heat dissipator integrated with the heat generator;

c) an electrically insulating and thermally conductive sheet configured to integrate the heat generator and the heat dissipator; and

d) a thermally conductive grease layer formed from a thermally conductive grease which is incompatible with the electrically insulating and thermally conductive sheet and is provided between at least one of (i) the electrically insulating and thermally conductive sheet and the heat generator and (ii) the electrically insulating and thermally conductive sheet and the heat dissipator;

wherein a change weight of at least one of the (i) thermally conductive grease layer and (ii) electrically insulating and thermally conductive sheet due to substance migration between the thermally conductive grease layer and the electrically insulating and thermally conductive sheet is less than 10%.

8. The heat dissipation assembly of claim 1 ,

wherein a change weight of at least one of the (i) thermally conductive grease layer and (ii) electrically insulating and thermally conductive sheet due to substance migration between the thermally conductive grease layer and the electrically insulating and thermally conductive sheet is less than 5%.

9. The heat dissipation assembly of claim 8 ,

wherein a change weight of at least one of the (i) thermally conductive grease layer and (ii) electrically insulating and thermally conductive sheet due to substance migration between the thermally conductive grease layer and the electrically insulating and thermally conductive sheet is less than 2%.

10. The heat dissipation assembly of claim 8 ,

wherein a change weight of at least one of the (i) thermally conductive grease layer and (ii) electrically insulating and thermally conductive sheet due to substance migration between the thermally conductive grease layer and the electrically insulating and thermally conductive sheet is less than 1%.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →