IP Library Granted Patent US 7,088,561
Granted Patent B2
US 7,088,561 · App. 11/069,411 · Granted Aug 8, 2006

Method of making a tunnel valve sensor with improved free layer sensitivity

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,088,561
App. No.
11/069,411
Granted
Aug 8, 2006
Kind
B2
Abstract

A tunnel junction having reduced free layer coercivity for improved sensitivity. The tunnel valve has a free layer that has been deposited in the presence of a nitrogen gas, which reduces the coercivity of the free layer, thereby improving the sensor's sensitivity and performance.

Claims (20)

1. A method of making a tunnel junction magnetoresistive sensor, comprising:

providing a substrate;

depositing a plurality of sensor layers on the substrate the depositing a plurality of sensor layers comprising;

depositing a magnetic pinned layer in the presence of nitrogen;

depositing a non-magnetic, electrically conductive barrier layer in the presence of nitrogen; and

depositing a free layer in the presence of nitrogen.

2. A method of making a tunnel junction magnetoresistive sensor, comprising:

providing a substrate;

depositing a plurality of sensor layers on the substrate; and

depositing a free layer on the plurality of sensor layers, the free layer being deposited by sputter depositing a magnetic material in an ion beam sputter deposition chamber in an atmosphere including nitrogen with a partial pressure of substantially 2×10 −5 Torr.

3. A method for manufacturing a tunnel valve magnetoresistive sensor, comprising:

depositing a first electrically conductive lead;

sputter depositing a pinnedlayer structure;

sputter depositing a free layer in the presence of a nitrogen gas; and

depositing a second electrically conductive lead.

4. A method as in claim 3 , wherein the sputter depositing a free layer is performed in a sputter deposition chamber containing nitrogen at a partial pressure of substantially 2×10 −5 Torr.

5. A method as in claim 3 , wherein the sputter depositing a free layer comprises depositing CoFe.

6. A method as in claim 3 , wherein thesputter depositing a non-magnetic, electrically insulating barrier layer is performed in the presence of nitrogen.

7. A method as in claim 3 , wherein the sputter depositing a non-magnetic, electrically insulating barrier layer included sputter depositing aluminum oxide in the presence of nitrogen.

8. A method as in claim 3 wherein the sputter depositing a pinned layer further comprises sputter depositing a magnetic material in the presence of nitrogen.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040819/0450 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →