IP Library Granted Patent US 7,136,551
Granted Patent B2
US 7,136,551 · App. 11/069,870 · Granted Nov 14, 2006

Optical printed circuit board and optical interconnection block using optical fiber bundle

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,136,551
App. No.
11/069,870
Granted
Nov 14, 2006
Kind
B2
Abstract

Disclosed is an optical printed circuit board (PCB) having a multi-channel optical waveguide, which comprises: an optical waveguide having an optical path for transmitting light beams; a groove for penetrating the optical waveguide; and an optical interconnection block inserted in the groove and connected to the optical waveguide to transmit the light beams, wherein the optical interconnection block includes an optical fiber bundle bent by the angle of 90°. The optical interconnection block connects a plurality of multi-layered optical waveguides to transmit light beams to the optical waveguides. The optical fiber bundle is installed as a medium of the multi-channel optical waveguide in the optical PCB.

Claims (9)

1. An optical printed circuit board (PCB) having a multi-channel optical waveguide, comprising:

an optical waveguide having an optical path for transmitting light beams;

a groove for penetrating the optical waveguide; and

an optical interconnection block inserted in the groove and connected to the optical waveguide to transmit the light beams,

wherein the optical interconnection block includes an optical fiber bundle bent by the angle of 90°, and a diameter of a core of an optical fiber of the optical fiber bundle ranges from 0.5 to 20 μm.

2. The optical PCB of claim 1 , wherein the optical interconnection block connects a plurality of multi-layered optical waveguides to transmit light beams to the optical waveguides.

3. The optical PCB of claim 1 , wherein the optical waveguide comprises a plurality of optical fibers, and a diameter of a core of the optical fiber ranges from 0.5 to 20 μm.

4. The optical PCB of claim 1 , wherein a radius of inside curvature of the optical fiber bundle ranges from 0.1 to 10 mm within the thickness of the optical PCB.

5. The optical PCB of claim 1 , wherein the optical fiber bundle is installed as a medium of the multi-channel optical waveguide in the optical PCB.

Assignments (2)
MERGER Recorded Oct 1, 2009
From: RESEARCH AND INDUSTRIAL COOPERATION GROUP, INFORMATION AND COMMUNICATIONS UNIVERSITY
To: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KAIST)
Reel/Frame 023312/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2005
From: CHO, MU HEE; CHO, HAN SEO; PARK, HYO HOON; LEE, JONG HO; KIM, KYUNG ROK
To: INFORMATION AND COMMUNICATION UNIVERSITY AND INDUSTRIAL COOPERATION GROUP; SKC CO., LTD.
Reel/Frame 016349/0544 →