Surface acoustic wave element, surface acoustic wave device, duplexer, and method of making surface acoustic wave element
View Patent ↗A surface acoustic wave element, a surface acoustic wave device, a duplexer, and a method of making a surface acoustic wave element which significantly restrain characteristics from deteriorating are provided. The surface acoustic wave element in accordance with the present invention comprises a piezoelectric substrate, and an IDT electrode formed on the piezoelectric substrate, whereas the piezoelectric substrate has a volume resistivity of not less than 3.6×10 10 Ω·cm and not more than 1.5×10 14 Ω·cm. This surface acoustic wave element comprises the piezoelectric substrate having a low volume resistivity, whereas the volume resistivity is reduced to 1.5×10 14 Ω·cm or less. Therefore, discharging is restrained from occurring between IDT electrodes, whereby characteristics are significantly kept from deteriorating. Also, since the volume resistivity of the piezoelectric substrate is not less than 3.6×10 10 Ω·cm, the IDT electrodes are significantly prevented from short-circuiting with each other.
1. A surface acoustic wave element comprising a piezoelectric substrate, and an IDT electrode formed on the piezoelectric substrate;
wherein the whole piezoelectric substrate is doped, the piezoelectric substrate being uniform throughout the substrate and has a volume resistivity of not less than 3.6×10 10 Ω·cm and not more than 1.5×10 14 Ω·cm, and wherein an electric charge distribution is uniform throughout a thickness direction of the substrate.
2. The surface acoustic wave element according to claim 1 , wherein the piezoelectric substrate is doped with at least one species of dopants among Fe, Mn, Cu, and Ti.
3. The surface acoustic wave element according to claim 2 , wherein the dopant ratio of the dopants is 1.24 wt % or less.
4. The surface acoustic wave element according to claim 1 , wherein the piezoelectric substrate is mainly consisted of lithium tantalate.
5. The surface acoustic wave element according to claim 1 , wherein the IDT electrode is consisted of Al or an Al alloy having a high orientation.
6. A surface acoustic wave device comprising:
a surface acoustic wave element including a piezoelectric substrate, and an IDT electrode formed on the piezoelectric substrate;
wherein the whole piezoelectric substrate is doped, the piezoelectric substrate being uniform throughout the substrate and has a volume resistivity of not less than 3.6×10 10 Ω·cm and not more than 1.5×10 14 Ω·cm, and wherein an electric charge distribution is uniform throughout a thickness direction of the substrate; and
a mount board including an electrode terminal formed on a surface for mounting the surface acoustic wave element, the electrode terminal electrically connecting with the IDT electrode.
7. A duplexer comprising:
a surface acoustic wave element including a piezoelectric substrate, and an IDT electrode formed on the piezoelectric substrate, the whole piezoelectric substrate being doped, and the piezoelectric substrate being uniform throughout the substrate and having a volume resistivity of not less than 3.6×10 10 Ω·cm and not more than 1.5×10 14 Ω·cm, and wherein an electric charge distribution is uniform throughout a thickness direction of the substrate.
8. A method of making a surface acoustic wave element, the method comprising the step of forming an IDT electrode on a piezoelectric substrate being uniform throughout the substrate, the whole piezoelectric substrate being doped with at least one species of dopants among Fe, Mn, Cu, and Ti, having a volume resistivity of not less than 3.6×10 10 Ω·cm and not more than 1.5×10 14 Ω·cm, and wherein an electric charge distribution is uniform throughout a thickness direction of the substrate.
9. The surface acoustic wave element according to claim 1 , wherein the volume resistivity is uniform throughout the piezoelectric substrate due to uniformly distributed doping.
10. The surface acoustic wave device according to claim 6 , wherein the volume resistivity is uniform throughout the piezoelectric substrate due to uniformly distributed doping.
11. The duplexer according to claim 2 , wherein the volume resistivity is uniform throughout the piezoelectric substrate due to uniformly distributed doping.
12. The method according to claim 8 , wherein the volume resistivity is uniform throughout the piezoelectric substrate due to uniformly distributed doping.