RF power amplifier assembly with heat pipe enhanced pallet
View Patent ↗An RF amplifier assembly employing a finned heat sink and a heat pipe enhanced aluminum pallet is disclosed. The hybrid heat pipe enhanced aluminum pallet reduces the spreading thermal conduction resistance associated with the conduction of localized energy from RF amplifier devices when compared to a copper pallet. The localized energy concentration of RF amplifier devices is spread along the length of the heat pipe increasing the overall efficiency of the heat sink coupled to the pallet and accommodating non-uniform heat loading. This reduces the junction temperature of the devices, which leads to higher mean time before failure and higher output levels. The pipes are formed and embedded into the pallet so as to pass under different areas of interest and extend to the under-utilized regions.
1. A power amplifier assembly, comprising:
at least one electronics module including an RF power amplifier circuit;
a pallet comprised of a support plate enhanced with plural heat pipes having substantially higher thermal conductivity than the support plate embedded in the support plate; and
a separate finned heat sink;
wherein the electronics module is mounted on the pallet and the pallet is mounted on the finned heat sink;
wherein the support plate is a generally rectangular shaped solid metal plate and includes one or more hollow channels that transverse a horizontal surface of the plate, and the heat pipes are mounted in said one or more channels; and
wherein the heat pipes have varying spacing along the length direction of the support plate.
2. A power amplifier assembly as set out in claim 1 , wherein the heat pipes each comprise a vacuumed hollow tube having a porous inner space containing a working fluid.
3. A power amplifier assembly as set out in claim 2 , wherein the support plate is composed of a first material having a first thermal conductivity, and the heat pipes each comprise a superior conductor having an effective thermal conductivity several orders of magnitude higher than the first thermal conductivity.
4. A power amplifier assembly as set out in claim 3 , wherein the support plate is composed of aluminum and the heat pipes are each comprised of a copper tube, a wicking structure or material, and a working fluid.
5. A power amplifier assembly as set out in claim 1 , wherein the finned heat sink is composed of aluminum.
6. A power amplifier assembly as set out in claim 1 , wherein the heat pipes have a generally cylindrical shape flattened on one surface portion to be coplanar with the surface of the support plate.
7. A power amplifier assembly as set out in claim 6 , wherein the heat pipes are curved along the length direction of the cylinder.
8. A power amplifier assembly as set out in claim 2 , wherein the RF power amplifier circuit comprises plural amplifier device modules and wherein each of the heat pipes are configured below each of the said modules.
9. A power amplifier assembly, comprising:
at least one electronics module including an RF power amplifier circuit;
a pallet comprised of a support plate enhanced with one or more heat pipes having substantially higher thermal conductivity than the support plate embedded in the support plate; and
a separate finned heat sink;
wherein the electronics module is mounted on the pallet and the pallet is mounted on the finned heat sink;
wherein the support plate is a generally rectangular shaped solid metal plate and includes one or more hollow channels that transverse a horizontal surface of the plate, and the one or more heat pipes are mounted in said one or more channels;
wherein the one or more heat pipes have a generally cylindrical shape flattened on one surface portion; and wherein the one or more heat pipes are inserted into the one or more channels through the top surface of the pallet and the flattened portion of the one or more heat pipes being coplanar with the top surface of the support plate.
10. A power amplifier assembly, comprising:
at least one electronics module including an RF power amplifier circuit;
a pallet comprised of a support plate enhanced with one or more heat pipes having substantially higher thermal conductivity than the support plate embedded in the support plate; and
a separate finned heat sink;
wherein the electronics module is mounted on the pallet and the pallet is mounted on the finned heat sink;
wherein the support plate is a generally rectangular shaped solid metal plate and includes one or more hollow channels that transverse a horizontal surface of the plate, and the one or more heat pipes are mounted in said one or more channels;
wherein the one or more heat pipes have a generally cylindrical shape flattened on one surface portion to be coplanar with the surface of the support plate; and
wherein the one or more heat pipes are inserted into the one or more channels through a bottom surface of the pallet and the support plate has an opening in the top surface extending down to the heat pipes.
11. A power amplifier assembly, comprising:
at least one electronics module including an RF power amplifier circuit;
a pallet comprised of a support plate enhanced with plural heat pipes having substantially higher thermal conductivity than the support plate embedded in the support plate; and
a separate finned heat sink;
wherein the electronics module is mounted on the pallet and the pallet is mounted on the finned heat sink;
wherein each of the heat pipes comprise a vacuumed hollow tube having a porous inner space containing a working fluid;
wherein the RF power amplifier circuit comprises a main amplifier device module and a lower power auxiliary amplifier device module and wherein each of the heat pipes are configured below said main module.
12. A modular heat pipe enhanced heat sink assembly, comprising;
a finned heat sink having a generally flat upper surface;
a generally rectangular support plate; and
a plurality of heat pipes mounted within the support plate, wherein the heat pipes are angled relative to each other having a spacing which varies along their length direction;
wherein the support plate is mounted onto the flat surface of the finned heat sink.
13. A modular heat pipe enhanced heat sink assembly as set out in claim 12 , wherein the heat pipe's interior wall is lined with a porous material and filled with a working fluid.
14. A modular heat pipe enhanced heat sink assembly as set out in claim 12 , wherein the support plate comprises at least one channel that transverses through the plate to a horizontal surface of the plate, wherein the channel receives at least one of the heat pipes and wherein the at least one heat pipe lies flush with the horizontal surface of the pallet.
15. A modular heat pipe enhanced heat sink assembly as set out in claim 12 , wherein the support plate comprises a first material having a first thermal conductivity; and each heat pipe is a superior conductor having an effective thermal conductivity several order of magnitude higher than the first thermal conductivity.
16. A modular heat pipe enhanced heat sink assembly as set out in claim 15 , wherein the finned heat sink is composed of aluminum, the support plate is composed of aluminum and each heat pipe is comprised of a copper tube, a wicking structure or material, and a working fluid.