Photo-imaged stress management layer for semiconductor devices
View Patent ↗A photo-imaged stress management layer for a semiconductor device is described. The stress management layer is located on an outer surface of a semiconductor device and may be patterned to address certain stress compensation requirements of the semiconductor device. The stress management layer may be manufactured onto the semiconductor device using a photolithographic procedure that allows both simple and complex patterns to be realized.
1. A method for manufacturing a stress management layer on a semiconductor device, the method comprising:
placing a photo sensitive compound on at least a portion of a surface of the semiconductor device;
patterning the photo sensitive compound on the surface of the semiconductor device using a photolithographic procedure;
removing excess photo sensitive compound from the surface to create the stress management layer; and
wherein the photo sensitive compound reduces stress on a package housing of the semiconductor device caused by expansion or contraction of the semiconductor device itself and is designed to transfer stress away from at least one particular component within the semiconductor device.
2. The method of claim 1 wherein the photolithographic procedure comprises exposing the photo sensitive compound to light through a pattern mask.
3. The method of claim 1 wherein the photo sensitive compound is placed on the at least a portion of the surface of the semiconductor device at a thickness between 10 to 100 microns.
4. The method of claim 1 wherein the photo sensitive compound is a material selected from a group consisting of Poly-Methacrylate, Benzo-Cyclo-Butene, SU-8 and Polyimide.
5. The method of claim 1 wherein the photo sensitive compound is patterned relative to the at least one component within the semiconductor device.
6. The method of claim 5 wherein the at least one component is an active region of a surface emitting laser.
7. The method of claim 1 wherein the stress management layer comprises a reservoir in which a material may be located.
8. The method of claim 7 wherein the material located within the reservoir is material that modifies light emitted from the semiconductor device.
9. The method of claim 7 wherein the material located within the reservoir is a material that senses the presence of a chemical exterior to the semiconductor device.
10. A semiconductor package comprising.
a outer housing of molding compound that provides a exterior surface of the semiconductor package;
a semiconductor device, positioned within the outer housing, having thermal properties that cause the device to expand or contract relative to temperature changes;
a stress management layer, positioned between the outer housing and the semiconductor device, having elastic properties which allow the stress management layer to absorb stress caused by the expansion or contraction of the semiconductor device; and
wherein the stress management layer is a photo sensitive compound that is manufactured on the semiconductor device using a photolithographic procedure and is designed to transfer stress away from at least one particular component within the semiconductor device.
11. The stress management layer of claim 10 wherein the photo sensitive compound is between 10-100 microns thick.
12. The stress management layer of claim 10 wherein the photo sensitive compound is selected from a group consisting of Poly-Methacrylate, Benzo-Cyclo-Butene, SU-8 and Polyimide.
13. The stress management layer of claim 10 wherein the semiconductor device is located within a transfer molded package.
14. The stress management layer of claim 10 wherein the semiconductor device is a surface emitting laser.
15. The stress management layer of claim 10 wherein the semiconductor device is located in an open molded package.
16. The stress management layer of claim 15 wherein the semiconductor device is a sensor.