IP Library Granted Patent US 7,196,393
Granted Patent B2
US 7,196,393 · App. 11/072,310 · Granted Mar 27, 2007

Semiconductor device including a high voltage transistor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,196,393
App. No.
11/072,310
Granted
Mar 27, 2007
Kind
B2
Abstract

A drain diffusion layer 11 b includes a low impurity concentration region 5 a and a high impurity concentration region 5 b , and the low impurity concentration region 5 a is located on the channel region side. An impurity layer 7 having an opposite conductivity type to the drain diffusion layer 11 b is formed in the channel region, at a position away from the low impurity concentration region 5 a by a distance T. Alternatively, the low impurity concentration region 5 a and the impurity layer 7 are located so as to contact each other. Still alternatively, a border impurity layer is provided between the low impurity concentration region 5 a and the impurity layer 7 . Thus, a semiconductor device including a high voltage transistor capable of suppressing the reduction of the electric current driving capability and performing stable driving, and a method for fabricating the same, can be provided.

Claims (13)

1. A semiconductor device including a high voltage transistor, the semiconductor device comprising:

a semiconductor substrate having a first conductivity type surface portion;

a second conductivity type source diffusion layer formed in the semiconductor substrate;

a drain diffusion layer including a second conductivity type low impurity concentration region and a second conductivity type high impurity concentration region having a higher impurity concentration than that of the low impurity concentration region, wherein the low impurity concentration region is formed on the side of the source diffusion layer;

a first conductivity type impurity layer provided between the source diffusion layer and the low impurity concentration region in the semiconductor substrate;

a gate insulating film provided on the first conductivity type impurity layer; and

a gate electrode provided on the gate insulating film;

wherein the low impurity concentration region and the impurity layer are positioned so as not to compensate for the impurity of each other.

2. A semiconductor device according to claim 1 , wherein the low impurity concentration region and the impurity layer are discrete from each other.

3. A semiconductor device according to claim 1 , wherein the low impurity concentration region and the impurity layer contact each other.

4. A semiconductor device according to claim 1 , further comprising a second conductivity type border impurity layer between the low impurity concentration region and the impurity layer.

5. A semiconductor device according to claim 1 , further comprising an insulating film for device isolation in the semiconductor substrate, wherein the low impurity concentration region is provided below the insulating film.

6. A semiconductor device according to claim 1 , wherein the low impurity concentration region and the impurity layer do not overlap each other in a vertical direction.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →
CHANGE OF NAME Recorded Mar 18, 2020
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 052184/0943 →