IP Library Granted Patent US 7,422,945
Granted Patent B2
US 7,422,945 · App. 11/073,764 · Granted Sep 9, 2008

Cell based integrated circuit and unit cell architecture therefor

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Quick Facts
Patent No.
US 7,422,945
App. No.
11/073,764
Granted
Sep 9, 2008
Kind
B2
Abstract

In a unit cell, a first conductive type active region and a second conductive type active region are provided. Those two active regions extend in a first direction. Each of the active regions have first and second ends thereof. The first end of the second conductive type active region opposes the second end of the first conductive type active region. A conductive pattern is provided to extend in the first direction across the first conductive type active region and the second conductive type active region. A first contact region is arranged adjacent the first end of the first conductive type active region in the first direction. A second contact region is arranged adjacent the second end of the second conductive type active region in the first direction.

Claims (26)

1. A method of designing an integrated circuit, comprising:

providing a unit cell including

a first active region, which extends in a first direction to have first and second ends thereof,

a second active region, which extends in the first direction to have first and second ends thereof, the first end of the second active region opposing the second end of the first active region,

a pair of conductive patterns, each of which extends in the first direction across the first active region and the second active region to have first and second ends in the first direction,

a first contact region formed in a well region and arranged directly adjacent to each of the first ends of the conductive patterns, and

a second contact region formed in the substrate and arranged directly adjacent to each of the second ends of the conductive patterns; and

providing conductive lines to selectively connect the first and second active regions to each other.

2. A method according to claim 1 , wherein the first active region is formed to have a first projecting region at the first end thereof which extends in the first direction toward the first contact region, and

wherein the second active region is formed to have a second projecting region at the second end thereof which extends in the first direction toward the second contact region.

3. A method according to claim 1 , wherein each of the conductive patterns extends in the first direction continuously with no break therein.

4. A method according to claim 1 , wherein each of the first ends of the conductive patterns is provided with a first wider portion extending in a second direction which is orthogonal to the first direction,

each of the second ends of the conductive patterns is provided with a second wider portion extending in the second direction,

the first contact region is arranged adjacent to each of the first wider portions of the conductive patterns, and

the second contact region is arranged adjacent to each of the second wider portions of the conductive patterns.

5. A method according to claim 4 , wherein the first active region is formed to have a first projecting region arranged adjacent to and opposing the first contact region, and

the second active region is formed to have a second projecting region arranged adjacent to and opposing the second contact region.

6. A method of designing a unit cell on a substrate, which is used for making an integrated circuit, comprising:

providing a first conductive type active region, which extends in a first direction to have first and second ends thereof;

providing a second conductive type active region, which extends in the first direction to have first and second ends thereof; the first end of the second conductive type active region opposing the second end of the first conductive type active region;

providing a pair of poly-silicon patterns each extending continuously in parallel to each other in the first direction across the first conductive type active region and the second conductive type active region;

providing a first contact region that is formed in a well region and arranged directly adjacent to first ends of each of the poly-silicon patterns; and

providing a second contact region that is formed in the substrate and arranged directly adjacent to second ends of each of the poly-silicon patterns,

wherein the first conductive type active region is formed to have a first projecting region at the first end thereof which extends in the first direction toward the first contact region,

the second conductive type active region is formed to have a second projecting region at the second end thereof which extends in the first direction toward the second contact region, and

the poly-silicon patterns are formed to be in contact with none of the first and second contact regions.

Assignments (1)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →