Anode for sputter coating
A sputtering anode is disclosed wherein the anode is in the form of a container or vessel; and, wherein the conducting surface communicating with a cathode is the inside surface of the container or vessel. The anode can be mounted outside of a coating chamber having its opening communicating with the chamber or alternatively may be mounted within the chamber. The anode may be an inlet port for receiving inert gas for use in forming the plasma and for pressurizing the anode.
1 . A sputtering apparatus anode for use in the sputtering of a material, comprising:
at least one anode defining a vessel having an opening to an electrically conductive inner body and having an outer body, the electrically conductive inner body being coupled to a voltage source for providing a voltage difference between the sputtering material and the conductive inner body.
2 . A sputtering apparatus anode as defined in claim 1 , wherein the opening is at one end, for communicating with a coating chamber.
3 . A sputtering apparatus anode as defined in claim 1 , wherein the opening is at one end, for allowing charged particles to flow between the electrically conductive inner body and a cathode within a coating chamber.
4 . A sputtering apparatus anode as defined in claim 1 , wherein the vessel has an inlet port for receiving an inert gas for igniting plasma in the presence of a sufficient voltage applied between the electrically conductive inner body and a cathode.
5 . A sputtering apparatus anode as defined in claim 1 adapted to be disposed outside of the coating chamber and physically coupled thereto such that the opening of the vessel is facing and open to the coating chamber.
6 . A sputtering apparatus anode as defined in claim 1 wherein the outer body of the vessel is comprised of a first material that is different than the inner body of the vessel.
7 . A sputtering apparatus anode as defined in claim 6 , wherein the first material is an insulating material.
8 . A sputtering apparatus anode as defined in claim 1 wherein the anode inner body is coupled to a switch for selectably floating, biasing or grounding the inner body.
9 . A sputtering apparatus anode as defined in claim 1 wherein the opening is substantially smaller than a circumference of the vessel so that charged particles can flow between the inner body of the vessel and a cathode and such that coating material is substantially impeded from being deposited into the vessel.
10 . A sputtering apparatus anode as defined in claim 1 fixedly coupled to an outside of a coating chamber such that in operation during coating, the anode serves as a conducting container and wherein charged particles flow between a cathode in the coating chamber and the inside of the vessel for coating a substrate disposed in the coating chamber with the material.
11 . A sputtering apparatus anode as defined in claim 1 wherein the opening has an area of >10 cm2.
12 . A sputtering apparatus anode as defined in claim 11 , wherein the opening is substantially circular and greater than 15 cm2.
13 . A sputtering apparatus anode as defined in claim 1 , wherein the inner body is comprised of copper.
14 . A sputtering apparatus anode as defined in claim 1 , wherein the inner body is comprised of stainless steel.
15 . A sputtering apparatus anode as defined in claim 3 , wherein gas and/or water lines are mounted to the anode outside of the coating chamber.
16 . A sputtering apparatus anode as defined in claim 1 wherein an inside of the vessel is substantially cylindrical or spherical in cross section.
17 . A sputtering apparatus anode as defined in claim 1 , wherein a surface area of the conductive inner body is at least 300 cm2
18 . A sputtering apparatus anode as defined in claim 4 , wherein the pressure in the anode cavity is the same as in the coating chamber
19 . A sputtering apparatus anode as defined in claim 4 , wherein the pressure in the anode cavity is at least 20% above the pressure in the coating chamber.
20 . A sputtering apparatus anode as defined in claim 4 , wherein the pressure in the anode cavity is at least two times above the pressure in the coating chamber.
21 . A sputtering apparatus anode as defined in claim 1 , wherein the anode is water cooled.
22 . A sputtering apparatus anode as defined in claim 1 wherein the opening has an area of 15 cm2 to 30 cm2.
23 . A sputtering apparatus anode as defined in claim 2 , wherein a surface area of the conductive inner body is at least 1200 cm2
24 . A sputtering apparatus for use in the sputtering of a material, comprising:
a first anode and a second anode, the first anode and the second anode each defining a vessel having an opening to an electrically conductive inner body and having an outer body, the electrically conductive inner body of each anode for coupling to voltage source for providing a voltage difference between a cathode and said inner body.
25 . A sputtering apparatus as defined in claim 24 , wherein the first anode and the second anode are electrically coupled with a same linear cathode.
26 . A sputtering apparatus as defined in claim 25 , wherein additional anodes in the form of vessels are coupled to one or more linear cathodes.
27 . A sputtering apparatus as defined in claim 25 wherein sputter distribution of coating material is controlled by electrically switching the anodes and, or, independently adjusting the gas flow to vessels of different anodes.
28 . A sputtering apparatus as defined in claim 25 wherein sputter distribution of coating material is controlled by use of a feedback loop having a spectrophotometer.
29 . A sputtering apparatus for use in the sputtering of a material, comprising:
an anode defining a vessel having an opening to an electrically conductive inner body and having an outer body; and
a cathode disposed proximate to and in communication with the anode, wherein the sides of the cathode are electrically insulated, and wherein
the electrically conductive inner body of the anode is coupled to a voltage source for providing a voltage difference between the cathode and the conductive inner body.
30 . A sputtering apparatus as defined in claim 29 wherein the sides of the cathode are coated with a dielectric coating.
31 . A sputtering apparatus as defined in claim 30 , wherein the dielectric coating is alumina to prevent arcing with the sides and bottom.
32 . A sputtering apparatus as defined in claim 29 , wherein the sides of the cathode are electrically insulated with one of insulating tape, a Teflon™ coating or plate and ceramic plates, or combinations thereof.