Medical lead and method for medical lead manufacture
The present invention provides a medical lead for implantation within a patient. The medical lead has a seem-less lead body having one or more electrodes secured to the distal end and one or more connector bands attached to the proximal end of the lead.
1 .- 2 . (canceled)
3 . A method of forming a medical lead, the method comprising:
forming a welding region within insulating material in a lead body of the medical lead to expose a conductor;
forming a conductive pad within the welding region by melting conductive material at a point over the welding region to form the conductive pad and electrically connecting the conductive pad to the conductor; and
electrically connecting an electrode to the conductive pad.
4 . A method in accordance with claim 3 wherein the welding region is formed using a laser.
5 . A method in accordance with claim 3 wherein the conductive material comprises a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—Ir, platinum, silver, gold, copper and vanadium.
6 . A method in accordance with claim 3 wherein the welding region is in the shape of a groove.
7 . A method in accordance with claim 3 further comprising:
welding the electrode to the conductive pad.
8 . A method in accordance with claim 3 wherein forming the conductive pad further comprises melting and welding the conductive pad to the conductor using a laser.
9 . A method in accordance with claim 3 wherein forming the conductive pad further comprises;
placing a length of wire over the welding region; and
melting the wire at a point such that ends of the wire are drawn into the welding region to form the conductive pad.
10 . A method of forming a medical lead, the method comprising:
forming a first welding region within insulating material in a lead body of the medical lead to expose a conductor;
forming a second welding region within the insulating material in the lead body of the medical lead to expose the conductor;
forming a first conductive pad within the first welding region by melting a first conductive material at a point over the first welding region to form the first conductive pad and electrically connecting the first conductive pad to the conductor;
forming a second conductive pad within the second welding region by melting a second conductive material at a point over the second welding region to form the second conductive pad and electrically connecting the second conductive pad to the conductor; and
electrically connecting an electrode to the first conductive pad and the second conductive pad.
11 . A method in accordance with claim 10 wherein the first and second welding regions are formed using a laser.
12 . A method in accordance with claim 10 wherein the first and second conductive material each comprise a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—Ir, platinum, silver, gold, copper and vanadium.
13 . A method in accordance with claim 10 wherein the first and second welding regions are in the shape of a groove.
14 . A method in accordance with claim 10 further comprising:
welding the electrode to the first conductive pad; and
welding the electrode to the second conductive pad.
15 . A method in accordance with claim 10 wherein forming the first conductive pad further comprises melting and welding the first conductive pad to the conductor using a laser, and forming the second conductive pad further comprises melting and welding the second conductive pad to the conductor using a laser.
16 . A method in accordance with claim 10 wherein forming the first conductive pad further comprises,
placing a length of first wire over the first welding region; and
melting the first wire at a point such that ends of the first wire are drawn into the first welding region to form the first conductive pad; and
wherein forming the second conductive pad further comprises,
placing a length of second wire over the second welding region; and
melting the second wire at a point such that ends of the second wire are drawn into the second welding region to form the second conductive pad
17 . A method of forming a medical lead, the method comprising:
forming a welding region within insulating material in a lead body of the medical lead to expose a conductor;
forming, using a laser, a conductive pad within the welding region by melting wire conductive material within the welding region to form the conductive pad thereby welding the conductive pad to the conductor; and
welding an electrode to the conductive pad.
18 . A method in accordance with claim 17 wherein the welding region is formed using a laser.
19 . A method in accordance with claim 17 wherein the conductive material comprises a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—Ir, platinum, silver, gold, copper and vanadium.
20 . A method in accordance with claim 17 wherein forming the conductive pad further comprises;
placing a length of wire over the welding region; and
melting the wire at a point such that ends of the wire are drawn into the welding region to form the conductive pad.