Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
View Patent ↗The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21 , and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22 A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
1. A semiconductor substrate jig used for arranging a film on a semiconductor substrate, wherein said semiconductor substrate jig comprises: a frame with a bottom; a set of plural annular members arranged concentrically within said frame and constructed so as to be individually movable in a direction perpendicular to said semiconductor substrate, heights of said annular members in said direction perpendicular to said semiconductor substrate gradually increases from an outer circumference toward an inner circumference; a biasing member for biasing each of said annular members toward said bottom of said frame; and an operating member contacting said annular members by operating movement in said frame and provided for biasing in a direction separating said annular members from said bottom of said frame, against bias force of said biasing member; wherein each of said annular members moves so as to gradually press and move said film arranged between said semiconductor substrate and said set of annular members toward said operating member.