Liquid-crystal display device and method of fabricating same
A LCD device that receives curing light sufficiently to thereby realize approximately uniform curing of the material of the sealing member without eliminating the conductive light-blocking members. A first substrate has a display area and a peripheral area located to surround the display area. The display area includes pixels arranged regularly. The peripheral area includes a sealing member, wiring lines connected to the pixels, and conductive light-blocking members. A second substrate is coupled with the first substrate. A liquid crystal layer is formed between the first and second substrates. The sealing member is formed to overlap with the wiring lines and the light-blocking members in such a way that a non-overlapping area of the sealing member with the wiring lines and the light-blocking members is equal to 25% per unit area of the sealing ember or greater.
1 .- 8 . (canceled)
9 . A method of fabricating a LCD device, comprising the steps of:
(a) forming a first substrate with a display area and a peripheral area located to surround the display area;
the peripheral area including wiring lines extended from the display area, and conductive light-blocking members;
(b) forming a sealing member in the peripheral area of the first substrate;
(c) dripping a liquid crystal on the first substrate within an area surrounded by the sealing member;
(d) coupling a second substrate with the first substrate in such a way as to confine the liquid crystal in a space defined by the first substrate, the second substrate, and the sealing member; and
(e) curing the sealing member by irradiating specific light to the sealing member;
wherein the sealing member is formed to overlap with the wiring lines and the light-blocking members in such a way that a non-overlapping area of the sealing member with the wiring lines and the light-blocking members is equal to 25% per unit area of the sealing member or greater.
10 . The method according to claim 9 , wherein the light-blocking members have penetrating holes arranged at locations that overlap with the sealing member;
and wherein the light for curing the sealing member is irradiated to the sealing member by way of the first substrate.
11 . The method according to claim 9 , wherein the second substrate includes an opposite light-blocking member with penetrating holes at a location that overlaps with the sealing member;
and wherein the light for curing the sealing member is irradiated to the sealing member by way of the second substrate.
12 .- 35 . (canceled)
36 . A method of fabricating a LCD device, comprising the steps of:
(a) forming a first substrate with a display area and a peripheral area located to surround the display area;
the peripheral area including wiring lines extended from the display area, and conductive light-blocking members;
(b) forming a sealing member in the peripheral area of the first substrate;
(c) dripping a liquid crystal on the first substrate within an area surrounded by the sealing member;
(d) coupling a second substrate with the first substrate in such a way as to confine the liquid crystal in a space defined by the first substrate, the second substrate, and the sealing member; and
(e) curing the sealing member by irradiating specific light to the sealing member;
wherein the sealing member is formed to overlap with the wiring lines and the light-blocking members in such a way that non-overlapping regions of the sealing member with the wiring lines and the light-blocking members are arranged regularly;
and wherein the non-overlapping regions are apart from each other at intervals of 80 Jim or less.
37 . The method according to claim 36 , wherein the light-blocking members have penetrating holes arranged at locations that overlap with the sealing member;
and wherein the light for curing the sealing member is irradiated to the sealing member by way of the first substrate.
38 . A method of fabricating a LCD device, comprising the steps of:
(a) forming a first substrate with a display area and a peripheral area located to surround the display area;
(b) forming a sealing member in the peripheral area of the first substrate;
(c) dripping a liquid crystal on the first substrate within an area surrounded by the sealing member;
(d) forming an opposite conductive light-blocking member on the second substrate;
(e) coupling a second substrate with the first substrate in such a way as to confine the liquid crystal in a space defined by the first substrate, the second substrate, and the sealing member; and
(e) curing the sealing member by irradiating specific light to the sealing member;
wherein the sealing member is formed to overlap with the opposite light-blocking member in such a way that non-overlapping regions of the opposite light-blocking member with the sealing member are arranged regularly;
and wherein the non-overlapping regions are apart from each other at intervals of 80 μm or less.
39 . The method according to claim 38 , wherein the opposite light-blocking member has penetrating holes arranged at locations that overlap with the sealing member;
and wherein the light for curing the sealing member is irradiated to the sealing member by way of the second substrate.
40 . A method of fabricating a LCD device, comprising the steps of:
(a) forming a first substrate with a display area and a peripheral area located to surround the display area;
(b) forming a sealing member in the peripheral area of the first substrate;
(c) dripping a liquid crystal on the first substrate within an area surrounded by the sealing member;
(d) forming an opposite conductive light-blocking member on the second substrate;
(e) coupling a second substrate with the first substrate in such a way as to confine the liquid crystal in a space defined by the first substrate, the second substrate, and the sealing member; and
(e) curing the sealing member by irradiating specific light to the sealing member;
wherein the sealing member is formed not to overlap with the opposite light-blocking member;
and wherein the light is irradiated to the sealing member by way of the second substrate.