Method for manufacturing semiconductor device
View Patent ↗There is provided a method for manufacturing the semiconductor device for obtaining capacitance characteristics of a larger capacitance and delay characteristics with higher efficiency. An embodiment according to the present invention employs the configuration of forming the gate polysilicon layer by conducting the customization by using the customized reticle. For example, gate polysilicon layer having a larger dimension such as gate length and the like is formed by using the dedicated gate reticle, only for an user who requests the countermeasure for the EMI noise. Having such process, a larger-scale capacitance can be provided without increasing the process cost.
1. A method for manufacturing a semiconductor device, comprising manufacturing the semiconductor device by forming a wiring based on circuit data of a basic cell including a transistor formed by employing a reticle having a predetermined pattern, comprising;
forming a conductive film over a semiconductor insulator; and
patterning said conductive film by employing a reticle having a predetermined first gate pattern for forming a gate electrode of said basic cell and a second gate pattern for forming a capacitor element in said basic cell.
2. The method according to claim 1 , wherein said second gate pattern is provided so as to form said capacitor element in said basic cell, which is not used as a transistor.
3. The method according to claim 1 , wherein said basic cell is a component, which comprises of an I/O buffer.