Heat dissipating structure for an electronic device and heat dissipating device
View Patent ↗A heat dissipating member has an inner wall, outer wall, and partition walls. The inner wall directly or indirectly receives heat transfer from the heat source. The outer wall opposes the inner wall at a distance. The partition walls connect the inner wall and the outer wall. The inner wall, the outer wall, and the partition walls define a plurality of through-holes along the inner wall and the outer wall. Each of the through-holes extends in a vertical direction within a tilt range in which gravitational influence is utilizable. Upper and lower ends of each of the through-holes open to the outside. Generated heat from the heat source is propagated to the outer wall via the inner wall and the partition walls. A predetermined amount of heat generated by the heat source passing through the outer side of the outer wall is determined so that rise in temperature of the outer side relative to the ambient temperature can be kept under a predetermined value.
1. A heat dissipating structure for an electronic device, comprising:
a heat source; and
a heat dissipating member having an inner wall, an outer wall, and partition walls, wherein the inner wall directly or indirectly receives heat transfer from the heat source, the outer wall has an inner side and an outer side, the inner side opposes the inner wall at a distance there from, the outer side is exposed to the outside, the partition walls connect the inner wall and the inner side of the outer wall, the inner wall, the inner side of the outer wall and the partition walls define a plurality of through-holes, the through-holes are arranged along at least one of either the inner wall or the outer wall, each of the through-holes extends in a vertical direction within a tilt range in which gravitational influence is utilizable, and upper and lower ends of each of the through-holes open to the outside;
wherein generated heat from the heat source is propagated to the outer wall via the inner wall and the partition walls, and
a predetermined amount of heat generated by the heat source passing from the heat source to the outer side of the outer wall is determined so that rise in temperature of the outer side relative to the ambient temperature can be kept under a predetermined value,
wherein at least the outer side of the outer wall is made of a low thermally conductive material.
2. The heat dissipating structure according to claim 1 , wherein
a region that directly or indirectly receives heat transfer from at least the heat source of the inner wall is made of a highly thermally conductive material.
3. The heat dissipating structure according to claim 1 , wherein
the inner wall, the partition walls, and the inner side of the outer wall are made of the same material, and
the partition walls have a shape that tapers from the inner wall towards the outer wall.
4. The heat dissipating structure according to claim 1 , wherein
the cross-section that is vertically orthogonal to the through-holes is approximately a quadrilateral, and
the width of the through-holes along the inner wall and the outer wall, interval between the inner wall and the outer wall, and the thickness of the partition walls are set in accordance with the thermal conductivity of the partition walls so as to effectively achieve a chimney effect due to the through-holes and heat transfer from the outer wall.
5. A heat dissipating device provided in an electronic device that has a heat source, comprising:
an inner wall that directly or indirectly receives heat transfer from the heat source;
an outer wall that has an inner side and an outer side, wherein the inner side opposes the inner wall at a distance from the inner wall, and the outer side is exposed to the outside; and
partition walls that connect the inner wall and the inner side of the outer wall, wherein the inner wall, the inner side of the outer wall and the partition walls define a plurality of through-holes, the through-holes are arranged along at least one of either the inner wall or the outer wall, each of the through-holes extends in a vertical direction within a tilt range in which gravitational influence is utilizable, and upper and lower ends of each of the through-holes open to the outside; wherein
generated heat from the heat source is propagated to the outer wall via the inner wall and the partition walls, and
a predetermined amount of heat generated by the heat source passing from the heat source to the outer side of the outer wall is determined so that rise in temperature of the outer side relative to the ambient temperature can be kept under a predetermined value,
wherein at least the outer side of the outer wall is made of a low thermally conductive material.
6. The heat dissipating device according to claim 5 , wherein
a region that directly or indirectly receives heat transfer from at least the heat source of the inner wall is made of a highly thermally conductive material.
7. The heat dissipating device according to claim 5 , wherein
the inner wall, the partition walls, and the inner side of the outer wall are made of the same material, and
the partition walls have a shape that tapers from the inner wall towards the outer wall.
8. The heat dissipating device according to claim 5 , wherein
the cross-section that is vertically orthogonal to the through-holes is approximately a quadrilateral, and
the width of the through-holes along the inner wall and the outer wall, interval between the inner wall and the outer wall, and the thickness of the partition walls are set in accordance with the thermal conductivity of the partition walls so as to effectively achieve a chimney effect due to the through-holes and heat transfer from the outer wall.