IP Library Granted Patent US 7,773,389
Granted Patent B2
US 7,773,389 · App. 11/080,672 · Granted Aug 10, 2010

Electronic component mounted structure and optical transceiver using the same

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Quick Facts
Patent No.
US 7,773,389
App. No.
11/080,672
Granted
Aug 10, 2010
Kind
B2
Abstract

An electronic component mounted structure has: a circuit board; two semiconductor elements that are mounted on the circuit board; and an AC coupling capacitor that is operable to cut off signals with a predetermined frequency or less and is provided between the two semiconductor elements. The AC coupling capacitor is mounted on the circuit board such that a part or a whole of the AC coupling capacitor is away from the surface of the circuit board.

Claims (18)

1. An electronic component mounted structure comprising:

a circuit board comprising a ground layer; two semiconductor elements that are mounted on the circuit board;

an impedance matching line provided on a surface of the circuit board provided between the two semiconductor elements;

an AC coupling capacitor connected to the impedance matching line and configured to cut off signals with a predetermined frequency or less and provided between the two semiconductor elements,

a first gap defined by a lower surface of the AC coupling capacitor and side surfaces of the impedance matching line; wherein the first gap is located directly below the AC coupling capacitor and a second gap provided at an area corresponding to the AC coupling capacitor in the ground layer, wherein the second gap is located directly below the first gap.

2. An optical transceiver comprising the electronic component mounted structure according to claim 1 ,

wherein one of the two semiconductor elements is a semiconductor laser for transmitting a light signal, and

the other of the two semiconductor elements is a driver for driving the semiconductor laser.

3. An optical transceiver comprising the electronic component mounted structure according to claim 1 ,

wherein an area of the second gap is not less than an area of the first gap.

4. An electronic component mounted structure comprising: a circuit board; two semiconductor elements that are mounted on the circuit board; an impedance matching line provided on a surface of the circuit board provided between the two semiconductor elements; and an AC coupling capacitor connected to the impedance matching line and configured to cut off signals with a predetermined frequency or less and provided between the two semiconductor elements, wherein the circuit board comprises a hole that is located directly below the AC coupling capacitor and extends from the surface of the circuit board to a ground layer through an insulator layer of the circuit board, wherein the hole extends through the ground layer and through the impedance matching line.

5. An optical transceiver comprising the electronic component mounted structure according to claim 1 ,

wherein one of the two semiconductor elements is a semiconductor laser for transmitting a light signal, and

the other of the two semiconductor elements is a driver for driving the semiconductor laser.

6. An optical transceiver comprising the electronic component mounted structure according to claim 4 .

7. An optical transceiver comprising the electronic component mounted structure according to claim 4 ,

wherein the hole extends through the impedance matching line.

8. The electronic component mounted structure according to claim 4 , wherein a lower surface of the AC coupling capacitor is exposed to the hole.

Assignments (1)
MERGER Recorded Jan 29, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032134/0723 →