IP Library Granted Patent US 7,569,186
Granted Patent B2
US 7,569,186 · App. 11/082,374 · Granted Aug 4, 2009

Systems for using sample processing devices

Assignee: 3M Innovative Properties Company
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Quick Facts
Patent No.
US 7,569,186
App. No.
11/082,374
Granted
Aug 4, 2009
Kind
B2
Abstract

Sample processing systems for processing sample materials located in sample processing devices that are separate from the system are disclosed. The sample processing systems include a rotating base plate with raised and/or non-planar thermal structures on which the sample processing devices are located during operation of the systems. The systems may also include structure to urge the sample processing devices against the base plate and thermal structures.

Claims (54)

1. A sample processing system comprising:

a base plate adapted to receive a sample processing device proximate a top surface of the base plate;

a thermal structure exposed on the top surface of the base plate, wherein an upper surface of the thermal structure contacts a sample processing device received proximate the top surface of the base plate, and wherein the upper surface of the thermal structure is raised relative to the top surface of the base plate adjacent the thermal structure;

a drive system adapted to rotate the base plate about an axis of rotation; and

an electromagnetic energy source adapted to direct electromagnetic energy at the thermal structure while the base plate is rotating about the axis of rotation.

2. A system according to claim 1 , wherein the thermal structure comprises shoulders that set the upper surface of the thermal structure off from the top surface of the base plate adjacent the thermal structure.

3. A system according to claim 1 , wherein the thermal structure comprises at least one raised protrusion that extends above surrounding portions of the upper surface of the thermal structure.

4. A system according to claim 1 , wherein the upper surface of the thermal structure comprises a non-planar surface.

5. A system according to claim 1 , wherein the thermal structure raises a sample processing device such that the sample processing device does not contact the top surface of the base plate adjacent the thermal structure.

6. A system according to claim 1 , wherein a plurality of the thermal structures are attached to the base plate.

7. A system according to claim 1 , wherein the thermal structure comprises a continuous ring structure.

8. A system according to claim 1 , wherein the thermal structure comprises a lower surface that is exposed proximate a bottom surface of the base plate.

9. A system according to claim 8 , wherein the thermal structure is opaque to the electromagnetic energy emitted by the electromagnetic energy source.

10. A system according to claim 1 , further comprising a platen adapted to force a sample processing device against the upper surface of the thermal structure.

11. A system according to claim 1 , further comprising a spindle that extends through a central opening in a sample processing device, the spindle adapted to draw the sample processing device towards the top surface of the base plate.

12. A system according to claim 1 , further comprising means for urging a sample processing device against the upper surface of the thermal structure.

13. A sample processing system comprising:

a base plate adapted to receive a sample processing device proximate a top surface of the base plate;

a thermal structure exposed on the top surface of the base plate, wherein an upper surface of the thermal structure contacts a sample processing device received proximate the top surface of the base plate, and wherein the upper surface of the thermal structure is raised relative to the top surface of the base plate adjacent the thermal structure, and wherein the thermal structure comprises shoulders that set the upper surface of the thermal structure off from the top surface of the base plate adjacent the thermal structure, and wherein the thermal structure comprises at least one raised protrusion that extends above the surrounding portions of the upper surface of the thermal structure, and still further wherein the thermal structure comprises a lower surface that is exposed proximate a bottom surface of the base plate;

a drive system adapted to rotate the base plate about an axis of rotation; and

an electromagnetic energy source adapted to direct electromagnetic energy at the thermal structure while the base plate is rotating about the axis of rotation.

14. A sample processing system comprising:

a base plate adapted to receive a sample processing device proximate a top surface of the base plate;

a thermal structure exposed on the top surface of the base plate, wherein the thermal structure comprises a non-planar upper surface;

a drive system adapted to rotate the base plate about an axis of rotation; and

an electromagnetic energy source adapted to direct electromagnetic energy at the thermal structure while the base plate is rotating about the axis of rotation.

15. A system according to claim 14 , wherein the thermal structure comprises shoulders that set the upper surface of the thermal structure off from the top surface of the base plate adjacent the thermal structure.

16. A system according to claim 14 , wherein the non-planar upper surface of the thermal structure comprises a plurality of raised protrusions extending upward from surrounding portions of the upper surface.

17. A system according to claim 14 , wherein the non-planar upper surface of the thermal structure raises a sample processing device received proximate the top surface of the base plate such that the sample processing device does not contact the top surface of the base plate adjacent the thermal structure.

18. A system according to claim 14 , wherein a plurality of the thermal structures are attached to the base plate.

19. A system according to claim 14 , wherein the thermal structure comprises a continuous ring structure.

20. A system according to claim 14 , wherein the thermal structure comprises a lower surface that is exposed proximate a bottom surface of the base plate.

21. A system according to claim 20 , wherein the thermal structure is opaque to the electromagnetic energy emitted by the electromagnetic energy source.

22. A system according to claim 14 , further comprising a platen adapted to force a sample processing device against the upper surface of the thermal structure.

23. A system according to claim 14 , further comprising a spindle that extends through a central opening in a sample processing device, the spindle adapted to draw the sample processing device towards the top surface of the base plate.

24. A system according to claim 14 , further comprising means for urging a sample processing device against the upper surface of the thermal structure.

25. A sample processing system comprising:

a base plate adapted to receive a sample processing device proximate a top surface of the base plate;

a thermal structure exposed on the top surface of the base plate, wherein the thermal structure comprises an upper surface that contacts a sample processing device received proximate the top surface of the base plate;

means for urging a sample processing device towards the top surface of the base plate, wherein the sample processing device is forced against the upper surface of the thermal structure;

a drive system adapted to rotate the base plate about an axis of rotation;

an electromagnetic energy source adapted to direct electromagnetic energy at the thermal structure while the base plate is rotating about the axis of rotation.

26. A sample processing system comprising:

a base plate adapted to receive a sample processing device proximate a top surface of the base plate;

a thermal structure exposed on the top surface of the base plate, wherein the thermal structure comprises an upper surface that contacts a sample processing device received proximate the top surface of the base plate;

a drive system adapted to rotate the base plate about an axis of rotation;

a platen adapted to force a sample processing device against the upper surface of the thermal structure; and

an electromagnetic energy source adapted to direct electromagnetic energy at the thermal structure while the base plate is rotating about the axis of rotation.

27. A sample processing system comprising:

a base plate adapted to receive a sample processing device proximate a top surface of the base plate;

a thermal structure exposed on the top surface of the base plate, wherein the thermal structure comprises an upper surface that contacts a sample processing device received proximate the top surface of the base plate;

a drive system adapted to rotate the base plate about an axis of rotation;

a spindle that extends through a central opening in a sample processing device, the spindle adapted to draw the sample processing device towards the top surface of the base plate; and

an electromagnetic energy source adapted to direct electromagnetic energy at the thermal structure while the base plate is rotating about the axis of rotation.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2022
From: DIASORIN S.P.A.
To: DIASORIN ITALIA S.P.A.
Reel/Frame 061363/0897 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2017
From: 3M INNOVATIVE PROPERTIES COMPANY
To: FOCUS DIAGNOSTICS, INC.
Reel/Frame 041628/0449 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2017
From: FOCUS DIAGNOSTICS, INC.
To: DIASORIN S.P.A.
Reel/Frame 041628/0470 →
Continuity (2)
Continuation 1003499300 · Dec 28, 2001
Related Publication 20050180890A1 · Aug 18, 2005