Method of fabricating inkjet nozzle

1. A method of fabricating an inkjet nozzle on a wafer substrate, the nozzle comprising:

a nozzle chamber, the nozzle chamber including a roof having an aperture defined therein, and sidewalls extending from the roof to the substrate

an actuator positioned in the nozzle chamber for ejecting ink through the aperture; and

control circuitry for controlling the actuator, the method comprising the steps of:

(a) providing a wafer substrate having control circuitry formed thereon;

(b) depositing first sacrificial material on the wafer;

(c) forming the actuator on the first sacrificial layer such that the actuator electrically connects with the control circuitry;

(d) depositing second sacrificial material over the actuator;

(e) defining openings in the second sacrificial material, the openings defining the positions of chamber sidewalls;

(f) depositing roof material over the second sacrificial material and into the openings;

(g) defining an aperture in the roof material; and

(h) removing the first and second sacrificial materials.

2. The method of claim 1 , wherein the control circuitry is formed by a CMOS process.

3. The method of claim 1 , wherein the actuator is a thermal actuator.

4. The method of claim 1 , wherein the roof material is deposited by PECVD.

5. The method of claim 1 , wherein an ink supply channel is back-etched to the nozzle prior to removing the sacrificial material.

6. The method of claim 1 , wherein a plurality of nozzles are formed on the wafer substrate.

7. The method of claim 1 , which forms part of a printhead fabrication process.