Manufacturing method of transflective LCD and transflective LCD thereof
View Patent ↗A manufacturing method of a transflective LCD comprising forming a multiple layer on a substrate by depositing transparent electrode layer and a gate metal layer sequentially, forming a gate line, a gate electrode, a gate pad forming part and a data pad forming part by patterning the multiple layer, forming a gate insulating layer, forming a semiconductor layer, forming a data line, a source electrode and a drain electrode, forming a passivation layer and an organic insulating layer and forming a gate pad and a data pad by providing contact holes exposing the transparent electrode layer on the gate pad forming part and the data pad forming part, respectively. Accordingly, it is an aspect of the present invention to provide a manufacturing method of a transflective LCD using less masks and a transflective LCD thereof.
1. A manufacturing method of a transflective LCD, the method comprising:
forming a multiple layer on a substrate by depositing transparent electrode layer and a gate metal layer sequentially;
forming a gate line, a gate electrode, a gate pad forming part and a data pad forming part by patterning the multiple layer;
forming a gate insulating layer;
forming a semiconductor layer;
forming a data line, a source electrode and a drain electrode;
forming a passivation layer, an organic insulating layer and a data line connecting contact hole exposing the gate metal layer of the data pad forming part;
forming a reflecting layer; and
forming a gate pad contact hole exposing the transparent electrode layer on the gate pad forming part and a data pad contact hole exposing the transparent electrode layer on the data pad forming part to form a gate pad and a data pad, which are formed of the multiple layer;
wherein the reflecting layer electrically connects the data line to the data pad through the data line connecting contact hole and the data pad contact hole.
2. The manufacturing method of claim 1 , wherein the forming the passivation layer and the organic insulating layer comprises forming a data pad connecting contact hole on the data line.