IP Library Granted Patent US 7,977,698
Granted Patent B2
US 7,977,698 · App. 11/084,517 · Granted Jul 12, 2011

System and method for surface mountable display

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Quick Facts
Patent No.
US 7,977,698
App. No.
11/084,517
Granted
Jul 12, 2011
Kind
B2
Abstract

A system and method is disclosed for allowing a solid substrate, such as a printed circuit board (PCB), to act as the support structure for an electronic circuit. In one embodiment, the LEDs which form a part of a scrambler assembly are constructed on a first substrate and the electrical connections are run to the edges of the substrate and end in electrical contacts positioned thereat. The substrate is then connected to the scrambler package by a series of electrical and mechanical connections to form the LED package. The electrical contacts which are part of the LED package extend from the LED package so as to enable electrical contact with a separate controller substrate.

Claims (41)

1. An electronic device comprising:

an electronic component housing;

at least one electronic component positionable within the electronic component housing;

the electronic component housing defining an area for receiving a substrate;

at least one set of electrical contacts positioned within the substrate receiving area, and contained by the electronic component housing, the at least one set of electrical contacts adapted for spring-load mating with a substrate positioned within the substrate receiving area, and;

a substrate for positioning within the substrate receiving area, the substrate comprising:

at least one electronic component mounted on the substrate, the at least one electronic component positioned such that when the substrate is within the substrate receiving area, the at least one electronic component is within the electronic component housing; and

means for electrically connecting the at least one electronic component with at least one set of electrical contacts when the substrate is positioned within the substrate receiving area.

2. The electronic device of claim 1 , wherein the at least one electronic component is a LED and the electronic component housing is a scrambler.

3. The electronic device of claim 1 , wherein the at least one set of electrical contacts spring-load mate with a side surface of the substrate.

4. The electronic device of claim 1 , wherein the at least one set of electrical contacts mate with a bottom surface of the substrate.

5. The electronic device of claim 1 , wherein the at least one set of electrical contacts are further adapted to maintain a positioned substrate in mating relationship with the electronic component housing.

6. The electronic device of claim 1 , wherein the at least one set of electrical contacts further comprise: a surface area for mating with a substrate not positioned within the substrate receiving area.

7. The device of claim 1 wherein the at least one electronic component is positioned in a reflector area that is sealed.

8. The device of claim 1 , wherein the at least one set of spring loaded electrical contacts configured to mechanically lock the substrate into place within the substrate receiving area.

9. A display device comprising:

a scrambler having a plurality of reflector partitions therein;

at least one LED positionable within certain of the plurality of reflector partitions;

a plurality of spring loaded electrical contacts positioned at peripheral locations around a bottom surface of the scrambler, the plurality of spring loaded electrical contacts in electrical communication with substrates in mating relationship within the peripheral locations; and,

a first substrate mated with the scrambler such that the plurality of spring loaded electrical contacts make electrical contact with electrical contacts on the first substrate, the first substrate comprising;

(a) at least one LED mounted thereon, the at least one LED positioned within one of the plurality of reflector partitions when the first substrate is in spring-loaded contact with the scrambler; and

(b) electrical connections between the at least one LED and the electrical contacts on the substrate.

10. The display device of claim 9 further comprising:

a second substrate mated with the scrambler such that a least a portion of each of the plurality of spring-loaded electrical contacts makes electrical contact with the second substrate.

11. The display device of claim 10 wherein the second substrate comprises a controller for controlling the at least one LED.

12. A substrate for supporting LEDs thereon, the substrate comprising:

a plurality of spaced apart LEDs, each of the plurality of spaced apart LEDs having electrical leads extending therefrom, and each of the plurality of spaced apart LEDs configured to be inserted into a partitioned reflector area of a light scrambler; and

a plurality of electrical contacts positioned at the periphery of the substrate, each of the plurality of electrical contacts configured to be in spring-loaded contact with the light scrambler.

13. The substrate of claim 12 wherein the spring-loaded contact comprises an electrical contact, a portion of which is configured for surface soldering onto a controller substrate.

14. The substrate of claim 13 wherein the plurality of electrical contacts are pads for mating with spring-loaded electrical contacts in the scrambler.

15. The LED substrate of claim 12 , wherein the plurality of electrical contacts are located on the sides of the substrate.

16. The LED substrate of claim 12 , wherein the plurality of electrical contacts are located on the top of the substrate.

17. The LED substrate of claim 12 , wherein the plurality of electrical contacts are located on the bottom of the substrate.

18. The substrate of claim 12 , wherein the plurality of electrical contacts are on one side only of the substrate.

19. An LED display comprising:

a substrate configured for supporting a plurality of LEDs;

a scrambler with a partitioned reflector separate from the substrate and configured for physically distributing light from the plurality of LEDs supported on the substrate;

spring loaded electrical contacts configured for flexibly locking the substrate to the scramble; and

means, including the spring loaded electrical contacts for transferring electrical control signals to the LEDs from a separate control board via a surface solder connection on the separate control board.

20. The LED display of claim 19 , wherein the spring loaded electrical contacts are physically mounted on the scrambler.

21. The LED display of claim 19 , wherein the spring loaded electrical contacts are physically mounted on the substrate.

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 47630 FRAME: 344. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 21, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0267 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 9/5/2018 PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0687. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0344 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0687 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
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PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
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MERGER Recorded May 7, 2013
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To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
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To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2005
From: FUNG, ELIZABETH CHING LING; CHIA, CHEE WAI; NG, JOH JOH; KOAY, HUI PENG
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 016562/0458 →