Glass-ceramic materials and electronic packages including same
A glass-ceramic is provided having a thermal expansion coefficient in a range of 4.0 to 8.5 ppm/° C., a dielectric constant in a range of 5–7 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO 2 in a range of 40–55 wt %, Al 2 O 3 in a range of 7–22 wt %, MgO in a range of 6 to less than 26 wt %, and at least one of BaO in an amount up to 35 wt %, SrO in an amount up to 37 wt % and ZnO in an amount up to 17 wt %. An electronic package is also provided, including one of a metal and sintered ceramic base member and a glass-ceramic substrate bonded to the base member.
1. A glass-ceramic material consisting essentially of SiO 2 in a range of 40 to 55 wt %, Al 2 O 3 in a range of 7 to 22 wt %, MgO in a range of 6 to less than 26 wt %, and at least one of BaO in an amount up to 35 wt %, SrO in an amount up to 37 wt % and ZnO in an amount up to 17 wt %;
said glass-ceramic material having a thermal expansion coefficient in a range of 4.0 to 8.5 ppm/° C., a dielectric constant in a range of 5–7 and a Quality factor Q of at least 400.
2. The glass-ceramic material of claim 1 , wherein said glass-ceramic material further includes at least one of B 2 O 3 in an amount up to 10 wt % and P 2 O 5 in an amount up to 4 wt %.
3. The glass-ceramic material of claim 1 , wherein said glass-ceramic material further includes a thermal expansion coefficient reducing additive that is added as a particulate after said glass-ceramic material is formed and pulverized into a powder.
4. The glass-ceramic material of claim 1 , wherein said glass-ceramic material further includes a thermal expansion coefficient increasing additive that is added as a particulate after said glass-ceramic material is formed and pulverized into a powder.
5. The glass-ceramic material of claim 1 , further including 0.1 to 20 wt % of another glass-ceramic material that is added as a particulate to said glass-ceramic material of claim 2 after said glass-ceramic material of claim 2 is formed and pulverized into a powder.
6. An electronic package comprising:
a metal base; and
a glass-ceramic substrate bonded to said metal base, said glass-ceramic substrate comprising a glass-ceramic material consisting essentially of SiO 2 in a range of 40 to 55 wt %, Al 2 O 3 in a range of 7 to 22 wt %, MgO in a range of 6 to less than 26 wt %, and at least one of BaO in an amount up to 35 wt %, SrO in an amount up to 37 wt % and ZnO in an amount up to 17 wt %, said glass-ceramic substrate having a thermal expansion coefficient in a range of 4–8.5 ppm/° C., a dielectric constant in a range of 5–7, and a Quality factor (1/loss tangent) Q of at least 400.
7. The electronic package of claim 6 , further comprising a bonding layer interposed between said metal base and said glass-ceramic substrate.
8. The electronic package of claim 7 , wherein said bonding layer comprises one of a solder and a low melting point glass contacting at least said metal base.
9. The electronic package of claim 6 , wherein said glass-ceramic material includes BaO and has a BaO—Al 2 O 3 -2SiO 2 barium aluminosilicate main crystal phase.
10. The electronic package of claim 6 , wherein said glass-ceramic material includes SrO and has a SrO—Al 2 O 3 -2SiO 2 strontium alumninosilicate main crystal phase.
11. The electronic package of claim 6 , wherein said glass-ceramic material includes ZnO and has a main crystal phase including at least one of zinc aluminosilicate and zinc aluminate.
12. A glass-ceramic material consisting essentially of SiO 2 in a range of 47 to 54 wt %, Al 2 O 3 in a range of 12 to 18 wt %, MgO in a range of 12 to 20 wt %, and ZnO in a range of 5 to 20 wt %, said glass-cerarnic material having a thermal expansion coefficient in a range of 5–22 ppm/° C., a dielectric constant in a range of 4–7 and a Quality factor Q of at least 400.
13. The glass-ceramic material of claim 12 , wherein said glass-ceramic material has a main crystal phase comprising at least one of cristobalite, trydimite and quartz.
14. The glass-ceramic material of claim 13 , wherein said glass-ceramic material has a thermal expansion coefficient in a range of 10 to 22 ppm/° C.
15. The glass-ceramic material of claim 12 , wherein said glass-ceramic material further includes a thermal expansion coefficient increasing material in an amount of 0.1 to 15 wt % that is added as a particulate to said glass-ceramic material after said glass ceramic material is formed and pulverized into a powder.
16. An electronic package comprising:
a base member; and
a glass-ceramic substrate comprising a glass-ceramic material consisting essentially of SiO 2 in a range of 47 to 54 wt %, Al 2 O 3 in a range of 12 to 18 wt %, MgO in a range of 12 to 20 wt %, and ZnO in a range of 5 to 20 wt % bonded to said base member, said glass-ceramic material having a thermal expansion coefficient in a range of 5–22 ppm/° C., a dielectric constant in a range of 4–7 and a Quality factor Q of at least 400.
17. An electronic package comprising:
a sintered ceramic base member; and
a glass-ceramic substrate comprising a glass-ceramic material consisting essentially of SiO 2 in a range of 40 to 55 wt %, Al 2 O 3 in a range of 7 to 22 wt %, MgO in a range of 6 to less tan 26 wt %, and at least one of BaO in an amount up to 35 wt %, SrO in an amount up to 37 wt % and ZnO in an amount up to 17 wt % bonded to said sintered ceramic base member, said glass-ceramic substrate having a thermal expansion coefficient in a range of 4.0 to 8.5 ppm/° C., a dielectric constant in a range of 5–7 and a Quality factor Q of at least 400.