Image capture apparatus
View Patent ↗A mounting board of a camera module of a mobile phone is screwed to an outer cover through cushions formed of rubber, sponge or the like. A solid state imaging device and an optical unit of the camera module are contained in an opening formed in the outer cover and do not contact the outer cover. The mounting board is connected to a main substrate through a flexible board. Accordingly, even if the mobile phone is dropped down, the camera module is prevented from breakage by the vibration or the shock applied to the mobile phone, because the vibration and the shock are not transmitted to the camera module directly.
1. An image capture apparatus comprising:
a camera module including a solid state imaging device formed such that a light receiving portion is Conned on a semiconductor substrate, a mounting board for mounting said solid state imaging device, and an optical unit attached on said solid state imaging device or said mounting board, and incorporating an image taking optical system for focusing subject images on said light receiving portion;
an outer cover, to which said camera module is attached, having an opening for exposing said optical unit; and
a plurality of cushions inserted in said mounting board, and provided between said camera module and said outer cover,
wherein said optical unit is positioned within said opening, and
wherein said mounting board has attachment holes in which said plurality of cushions is inserted, and said outer cover has threaded holes provided at a position corresponding to said attachment holes of said mounting board, for receiving screws which each screw penetrates one of said plurality of cushions.
2. An image capture apparatus as described in claim 1 , wherein each of said cushions is positioned between said mounting board and said outer cover, and said solid state imaging device and said optical unit are placed not to contact said outer cover.
3. An image capture apparatus as described in claim 1 , wherein each of said plurality of cushions comprises approximately cylindrical half bushes with flange, and said half bushes are respectively inserted into said attachment holes from opposite sides of said mounting board.
4. An image capture apparatus as described in claim 1 , wherein said plurality of cushions covers a portion of said camera module without blocking an optical path of said optical unit, and a portion of said cushion is attached to said outer cover.
5. An image capture apparatus as described in claim 1 , wherein said mounting board is connected to another electronic component which is disposed inside said outer cover through a flexible wiring.
6. An image capture apparatus as described in claim 5 , further comprising a transistor for amplifying an output signal from said solid state imaging device being mounted on said flexible wiring.
7. An image capture apparatus as described in claim 1 , further comprising a transparent plate for covering said opening.
8. An image capture apparatus as described in claim 1 , wherein said image capture apparatus comprises a mobile phone.
9. An image capture apparatus as described in claim 1 , wherein an entirety of said optical unit is positioned within said opening.
10. An image capture apparatus as described in claim 1 , wherein the cushion is at least one of a rubber, a sponge rubber, coil springs, and a bag including a gas or fluid.
11. An image capture apparatus as described in claim 1 , wherein the plurality of cushions is configured to accommodate an attachment mechanism therethrough.
12. An image capture apparatus as described in claim 1 , wherein each of the plurality of cushions comprises at least two cushions, wherein a part of the camera module is sandwiched by the at least two cushions.
13. An image capture apparatus as described in claim 1 , wherein said mounting board has at least one attachment hole in which said plurality of cushions is inserted.
14. An image capture apparatus comprising:
a camera module including a solid state imaging device formed such that a light receiving portion is formed on a semiconductor substrate, a mounting board for mounting said solid state imaging device, and an optical unit attached on said solid state imaging device or said mounting board, and incorporating an image taking optical system for focusing subject images on said light receiving portion:
an outer cover, to which said camera module is attached, having an opening for exposing said optical unit; and
a plurality of cushions inserted in said mounting board, and provided between said camera module and said outer cover,
wherein said optical unit is positioned within said opening, and
wherein each of said cushions comprises an approximately cylindrical half bush with a flange, and said half bushes are respectively inserted into an attachment hole from opposite sides of said mounting board.