IP Library Granted Patent US 7,319,628
Granted Patent B2
US 7,319,628 · App. 11/091,523 · Granted Jan 15, 2008

Semiconductor memory and method for manufacturing the same

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Quick Facts
Patent No.
US 7,319,628
App. No.
11/091,523
Granted
Jan 15, 2008
Kind
B2
Abstract

A semiconductor memory includes a plurality of memory portions; and a plurality of spare memory portions. The memory portion includes: a main cell array which includes memory cells, a first reference cell which stores a first reference data in a nonvolatile state, and a first sense amplifier which reads a first state of the memory cell based on the first state and a second state of the first reference cell. The memory cell stores data in a nonvolatile state. The spare memory portion includes: a spare cell array which includes spare cells as spares of the memory cells, a second reference cell which stores a second reference data in a nonvolatile state, and a second sense amplifier which reads a third state of the spare cell based on the third state and a fourth state of the second reference cell. The memory portion having a defect on the first reference cell is replaced with the spare memory portion.

Claims (38)

1. A semiconductor memory comprising:

a plurality of memory portions; and

a plurality of spare memory portions,

wherein each of said plurality of memory portions includes:

a main cell array which includes a plurality of memory cells, each of said plurality of memory cells stores data in a nonvolatile state,

a first reference cell which stores a first reference data in a nonvolatile state, and

a first sense amplifier which reads a first state of said each of the plurality of memory cells, based on said first state and a second state of said first reference cell,

each of said plurality of spare memory portions includes:

a spare cell array which is provided as a spare of said main cell array, and includes a plurality of spare cells as spares of said plurality of memory cells,

a second reference cell which stores a second reference data in a nonvolatile state, and a second sense amplifier which reads a third state of said each of the plurality of spare cells, based on said third state and a fourth state of said second reference cell,

one of said plurality of memory portions is replaced with one of said plurality of spare memory portions, if said one of said plurality of memory portions is a defective memory portion which has a defect on said first reference cell.

2. The semiconductor memory according to claim 1 , further comprising:

a control portion which includes a replacement portion, and outputs a first switching signal based on a state of said replacement portion and an input of a first signal which selects said defective memory portion in an operation; and

a switching portion which selects an output of said one of the plurality of spare memory portions substituted for said defective memory portion, based on said first switching signal.

3. The semiconductor memory according to claim 2 , wherein said replacement portion is set such that said control portion outputs said first switching signal based on said first signal in said operation.

4. A semiconductor memory comprising:

a plurality of memory portions;

a plurality of spare memory portions; and

a control portion,

wherein each of said plurality of memory portions includes:

a plurality of memory cells, and

a first reference cell,

each of said plurality of spare memory portions includes:

a plurality of spare memory cells, and

a second reference cell,

said control portion includes:

a first control portion, and

a second control portion,

said first control portion stores a replacement data regarding said plurality of memory portions and said plurality of spare memory portions;

said second control portion stores a replacement data regarding said first reference cell and said second reference cell.

5. The semiconductor memory according to claim 4 , wherein said control portion replaces one of said plurality of memory portions with one of said plurality of spare memory portions, when one of at least one of said plurality of memory cells and said first reference cell is defective.

6. The semiconductor memory according to claim 4 , wherein said each of the plurality of spare memory cells further includes a third reference cell,

said second control portion further replaces said second reference cell with said third reference cell, when one of at least one of said plurality of spare cells and said second reference cell is defective.

7. The semiconductor memory according to claim 4 , wherein said plurality of memory cells and said plurality of spare cells are nonvolatile memories.

8. The semiconductor memory according to claim 4 , wherein, said first reference cell and said second reference cell are nonvolatile memories.

9. A method of replacing a defective reference cell comprising;

detecting a defective reference cell in a cell array which has a sense amplifier and memory cells; and

in response to detecting the defective reference cell, replacing the cell array with a spare array which has a spare reference cell, a spare sense amplifier and spare memory cells.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2005
From: SUGAWARA, HIROSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016430/0357 →