Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
View Patent ↗A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
1. A polishing pad for use in chemical mechanical polishing of substrates, said polishing pad having a polishing surface, comprising:
a porous fibrous matrix;
a binder for binding said fibrous matrix;
said fibrous matrix forming a porous structure by which polishing slurry and polishing debris during chemical mechanical polishing of substrates are temporarily stored for subsequent rinsing away, and for enhanced flow-distribution of the polishing slurry;
said fibrous matrix comprising an end-point-detection transparent window section for allowing light beams from an end-point detection apparatus to pass therethrough wherein said fibrous matrix comprises a lower-density area, said lower-density area having a density less than at least part of the remainder of said fibrous matrix.
2. The polishing pad for use in chemical mechanical polishing of substrates according to claim 1 , wherein said end-point-detection transparent window section comprising said lower-density area and laser-transparent polymer material interspersed in said lower-density area.
3. The polishing pad for use in chemical mechanical polishing of substrates according claim 2 , wherein said at least part of the remainder of said fibrous matrix comprises a higher-density surrounding section immediately adjacent to, and encompassing, said lower-density area; said higher-density surrounding section controlling the degree of dispersion of said laser-transparent polymer material interspersed in said lower-density area into the remainder of said fibrous matrix exterior of said lower-density area.
4. The polishing pad for use in chemical mechanical polishing of substrates according claim 1 , wherein said end-point-detection transparent window section comprises laser-transparent polymer material; said fibrous matrix comprising a surrounding section that immediately surrounds said end-point-detection transparent window section; said surrounding section comprising a diffusion zone; said laser-transparent polymer material being diffused in said diffusion zone of said surrounding section, whereby said window-section is bonded to said fibrous matrix.
5. The polishing pad for use in chemical mechanical polishing of substrates according claim 4 , wherein said fibrous matrix comprises a front working surface for use in polishing and a back surface for mounting to a platen of a CMP apparatus; said end-point-detection transparent window section being made of laser-transparent polymer material; said end-point-detection transparent window section being stepped and having a larger cross-sectional area toward said back surface for increasing structural integrity.
6. The polishing pad for use in chemical mechanical polishing of substrates according claim 4 , wherein said fibrous matrix comprises a front working surface for use in polishing and a back surface for mounting to a platen of a CMP apparatus; said polishing pad further comprising a reinforcing impervious layer attached to said back surface for providing additional structural integrity to said window section in said fibrous matrix; said reinforcing impervious layer having a cutout in alignment with said end-point-detection transparent window section for allowing the light beam from an end-point-detection device to pass therethrough, said reinforcing impervious layer being fused to said back surface.
7. The polishing pad for use in chemical mechanical polishing of substrates according claim 6 , wherein reinforcing impervious layer is fused to said back surface by heating said reinforcing impervious layer to cause a fused bond with said back surface; said polishing pad further comprising an adhesive backing layer for attaching said fibrous matrix to a platen; said adhesive backing layer being attached to said reinforcing impervious layer; said reinforcing impervious layer being sandwiched between said window section and said adhesive backing layer; said reinforcing impervious layer preventing slurry from contacting said adhesive backing layer during the CMP polishing process; said adhesive backing layer also having a cutout in alignment with said cutout of said reinforcing impervious layer for allowing the light beam from an end-point-detection device to pass therethrough.
8. The polishing pad for use in chemical mechanical polishing of substrates according claim 1 , wherein said end-point-detection transparent window section comprises a window-plug made of laser-transparent polymer material; said fibrous matrix having a cutout section in which said window-plug is received;
said fibrous matrix comprising a front working surface for use in polishing and a back surface for mounting to a platen of a CMP apparatus;
said polishing pad further comprising a reinforcing impervious layer attached to said back surface for providing structural integrity to said window-plug in said fibrous matrix; said reinforcing impervious layer having a cutout in alignment with said cutout section of said fibrous matrix for allowing the light beam from an end-point-detection device to pass therethrough; said cutout being of less cross-sectional area than the juxtapositioned portion of said window-plug thereat in order to form an overlapping section of said reinforcing impervious layer that overlaps said juxtapositioned portion of said window-plug;
said overlapping section of said reinforcing impervious layer being fused to said juxtapositioned portion of said window-plug for bonding said reinforcing impervious layer to said juxtapositioned portion of said window-plug;
said reinforcing impervious layer also being fused to said back surface of said fibrous matrix.
9. The polishing pad for use in chemical mechanical polishing of substrates according claim 8 , wherein said polishing pad further comprises an adhesive backing layer for attaching said fibrous matrix to a platen; said adhesive backing layer being attached to said reinforcing impervious layer; said reinforcing impervious layer being sandwiched between said window-plug and said adhesive backing layer; said reinforcing impervious layer preventing slurry from contacting said adhesive backing layer during the CMP polishing process; said adhesive backing layer also having a cutout in alignment with said cutout of said reinforcing impervious layer for allowing the light beam from an end-point-detection device to pass therethrough.