Passivation of power semiconductor device

1. A vertical power semiconductor device, comprising:

a substrate including a first layer that is a first conductivity type;

a first conductive region provided proximate an upper surface of the substrate, the first conductive region being a second conductivity type that is different from the first conductivity type;

first and second electrodes, the first electrode being proximate the upper surface of the substrate and coupled to the first conductive region, the second electrode being proximate a lower surface of the substrate;

a passivation structure including first and second dielectric layers provided over the upper surface of the substrate;

one or more field plates of a first type provided between the first and second dielectric layers;

an oxide layer provided between the first dielectric layer and the upper surface of the substrate;

second and third conductive regions provided proximate the upper surface of the substrate, the second and third conductive regions being provided on opposing ends of the first conductive region, each of the second third conductive regions being the second conductivity type,

wherein the one or more field plates of the first type includes first and second field plates, the first field plate coupling the second conductive region, the second field plate coupling the third conductive region.

2. The device of claim 1 , wherein the first conductive region is an emitter region, and the second and third conductive regions are guard ring regions, and the first dielectric layer is a glass layer, and the second dielectric layer is a polyimide layer.

3. A vertical power semiconductor device, comprising:

a substrate including a first layer that is a first conductivity type;

a first conductive region provided proximate an upper surface of the substrate, the first conductive region being a second conductivity type that is different from the first conductivity type;

first and second electrodes, the first electrode being proximate the upper surface of the substrate and coupled to the first conductive region, the second electrode being proximate a lower surface of the substrate;

a passivation structure including first and second dielectric layers provided over the upper surface of the substrate; and

one or more field plates of a first type provided between the first and second dielectric layers,

wherein the first and second dielectric layers are polyimide layers.

4. A vertical power semiconductor device, comprising:

a substrate including a first layer that is a first conductivity type;

a first conductive region provided proximate an upper surface of the substrate, the first conductive region being a second conductivity type that is different from the first conductivity type;

first and second electrodes, the first electrode being proximate the upper surface of the substrate and coupled to the first conductive region, the second electrode being proximate a lower surface of the substrate;

a passivation structure including first and second dielectric layers provided over the upper surface of the substrate, the second dielectric layer substantially covering the upper surface of the substrate; and

one or more field plates of a first type provided between the first and second dielectric layers,

wherein the second dielectric layer is the uppermost layer of the device,

wherein the first and second dielectric layers are polyimide layers.

5. A vertical power semiconductor device, comprising:

a substrate including a first layer that is a first conductivity type;

a first conductive region provided proximate an upper surface of the substrate, the first conductive region being a second conductivity type that is different from the first conductivity type;

first and second electrodes, the first electrode being proximate the upper surface of the substrate and coupled to the first conductive region, the second electrode being proximate a lower surface of the substrate;

a passivation structure including first and second dielectric layers provided over the upper surface of the substrate;

one or more field plates of a first type provided between the first and second dielectric layers;

an oxide layer provided between the substrate and the first dielectric layer;

a plurality of field plates of a second type provided between the oxide layer and the first dielectric layer; and

a plurality of guard ring regions provided proximate the upper surface of the substrate,

wherein the plurality of field plates of the second type includes third and fourth field plates, and the plurality of guard ring regions includes first and second guard ring regions,

wherein the third and fourth field plates are coupled to the first and second guard ring regions, respectively,

wherein the third and fourth field plates are coupled to the first conductive region,

wherein the first and second dielectric layers are glass and polyimide layers, respectively, or are oxide and polyimide layers, respectively, and

wherein the first and second dielectric layers are polyimide layers, and the device is a single insulated gate bipolar transistor.

6. A power device, comprising:

an n-type substrate having an upper surface and a lower surface;

first and second electrodes provided proximate the upper and lower surfaces, respectively;

an emitter region coupled to the first electrode;

a guard ring surrounding the emitter region;

an oxide layer provided on the substrate;

a dielectric layer provided on the oxide;

a field plate provided on the dielectric layer and coupled to the guard ring;

a polyimide layer provided on the field plate and the dielectric layer.

7. The power device of claim 6 , wherein the dielectric layer is a glass layer that is formed using a physical vapor deposition method.

8. The power device of claim 6 , wherein the dielectric layer is an oxide layer or another polyimide layer.

9. The power device of claim 7 , wherein the polyimide layer is the uppermost layer of the device and is configured to reduce arcing effects.

10. The power device of claim 6 , further comprising:

another field plate provided between the oxide layer and the dielectric layer and coupling the guard ring and the emitter.

11. A method of forming a power device, comprising:

providing an n-type substrate having an upper surface and a lower surface;

providing first and second electrodes provided proximate the upper and lower surfaces, respectively;

providing an emitter region coupled to the first electrode;

providing a guard ring surrounding the emitter region;

providing an oxide layer on the substrate;

providing a first polyimide layer on the oxide layer;

performing plasma activation on the first polyimide layer; and

providing a second polyimide layer on the first polyimide,

wherein the device includes a field plate between the first and second polyimide layers.