Techniques for partitioning radios in wireless communication systems
View Patent ↗A method and apparatus is provided for partitioning a radio using a multi-chip module to group some or all of the components of the radio in a single package. In one example, a radio uses a multi-chip module, including a chip carrier. Various components of the radio reside in integrated circuits that are mounted to the chip carrier. If desired, one or more antennas can be integrated into the chip carrier.
1. A multi-band RF apparatus used for wireless communications comprising:
a chip carrier having a substrate;
a first integrated circuit mounted on the chip carrier;
a transceiver formed on the first integrated circuit, the transceiver configured to transmit and receive in multiple frequency bands;
a first power amplifier electrically coupled to the transceiver and configured to amplify signals in a first frequency band;
a second power amplifier electrically coupled to the transceiver and configured to amplify signals in a second frequency band;
a first antenna electrically coupled to the first power amplifier for transmitting and receiving signals in the first frequency band;
a second antenna electrically coupled to the second power amplifier for transmitting and receiving signals in the second frequency band, wherein the first and second antennas are integrated in the substrate of the chip carrier;
a third antenna electrically coupled to the transceiver for receiving signals in the first frequency band;
a fourth antenna electrically coupled to the transceiver for receiving signals in the second frequency band, wherein the first, second, third, and fourth antennas are integrated in the substrate of the chip carrier;
a first isolator electrically coupled between the first antenna and the first power amplifier; and
a second isolator electrically coupled between the second antenna and the second power amplifier.
2. The multi-band RF apparatus of claim 1 , further comprising an antenna switch module electrically coupling the first and second antennas with the respective first and second power amplifiers.
3. The multi-band RF apparatus of claim 1 , further comprising one or more circulators electrically coupling the first and second antennas with the respective first and second power amplifiers.
4. The multi-band RF apparatus of claim 1 , wherein the first and second power amplifiers each include multiple stages, and wherein at least one stage of each of the first and second power amplifiers is formed on the first integrated circuit and at least one stage of each of the multi-stage power amplifiers is formed on a second integrated circuit.
5. The multi-band RF apparatus of claim 4 , wherein the first and second integrated circuits are mounted on the chip carrier.
6. The multi-band RF apparatus of claim 1 , further comprising a baseband controller electrically coupled to the transceiver.
7. The multi-band RF apparatus of claim 1 , wherein the chip carrier is a multi-layer ceramic chip carrier, and wherein the first and second antennas are formed using one or more layers of the multi-layer ceramic chip carrier.
8. A multi-band RF apparatus used for wireless communications comprising:
a chip carrier having a substrate;
a first integrated circuit mounted on the chip carrier;
a transceiver formed on the first integrated circuit, the transceiver configured to transmit and receive in multiple frequency bands;
a first power amplifier electrically coupled to the transceiver and configured to amplify signals in a first frequency band;
a second power amplifier electrically coupled to the transceiver and configured to amplify signals in a second frequency band;
a first antenna electrically coupled to the first power amplifier for transmitting signals at the first frequency band;
a second antenna electrically coupled to the transceiver for receiving signals at the first frequency band;
a third antenna electrically coupled to the second power amplifier for transmitting signals at the second frequency band;
a fourth antenna electrically coupled to the transceiver for receiving signals at the second frequency band, wherein the first, second, third, and fourth antennas are integrated in the substrate of the chip carrier;
a first isolator electrically coupled between the first antenna and the first power amplifier; and
a second isolator electrically coupled between the third antenna and the second power amplifier.
9. The multi-band RF apparatus of claim 8 , further comprising a first low pass filter electrically coupled between the first antenna with the first power amplifier.
10. The multi-band RF apparatus of claim 9 , further comprising a second low pass filter electrically coupled between the third antenna with the second power amplifier.
11. The multi-band RF apparatus of claim 8 , further comprising a first band pass filter electrically coupled between the second antenna with the transceiver.
12. The multi-band RF apparatus of claim 11 , further comprising a second band pass filter electrically coupled between the fourth antenna with the transceiver.
13. The multi-band RF apparatus of claim 8 , further comprising a first surface-acoustic-wave (SAW) filter electrically coupled between the second antenna with the transceiver.
14. The multi-band RF apparatus of claim 13 , further comprising a second surface-acoustic-wave (SAW) filter electrically coupled between the fourth antenna with the transceiver.
15. The multi-band RF apparatus of claim 8 , wherein the first and second power amplifiers each include multiple stages, and wherein at least one stage of each of the first and second power amplifiers is formed on the first integrated circuit and at least one stage of each of the multi-stage power amplifiers is formed on a second integrated circuit.
16. The multi-band RF apparatus of claim 8 , wherein the first and second power amplifier are at least partially formed on a second integrated circuit, and wherein the second integrated circuit is mounted on the chip carrier.
17. The multi-band RF apparatus of claim 16 , wherein the first, second, third, and fourth antennas are integrated as a part of the chip carrier.
18. The multi-band RF apparatus of claim 17 , wherein the chip carrier is a ceramic chip carrier.
19. The multi-band RF apparatus of claim 8 , wherein the chip carrier is a multi-layer chip carrier, wherein the first, second, third, and fourth antennas are formed using one or more layers of the multi-layer chip carrier.
20. A method of providing wireless RF communications comprising:
forming a transceiver using one or more integrated circuits;
forming first and second power amplifiers using the one or more integrated circuits;
mounting the one or more integrated circuits to a chip carrier having a substrate;
forming first and second antennas in the substrate of the chip carrier;
configuring the transceiver to transmit and receive signals in multiple frequency bands;
configuring the first power amplifier to amplify signals in a first frequency band;
configuring the second power amplifier to amplify signals in a second frequency band;
coupling the first antenna to the first power amplifier for transmitting signals in the first frequency band;
coupling the second antenna to the second power amplifier for transmitting signals in the second frequency band;
coupling a third antenna to the transceiver for receiving signals in the first frequency band;
coupling a fourth antenna to the transceiver for receiving signals in the second frequency band;
electrically coupling a first isolator between the first antenna and the first power amplifier; and
electrically coupling a second isolator between the second antenna and the second power amplifier.
21. The method of claim 20 , wherein the chip carrier is a ceramic chip carrier.