Imaging sensor
An imaging sensor having a stacked structure of at least three layers capable of absorbing/photoelectrically converting electromagnetic waves of at least blue light, green light and red light, and further comprising at least one construction selected from those where at least one of an ultraviolet absorbing layer, an infrared absorbing layer, a black visible light absorbing layer, a fourth electromagnetic wave absorption/photoelectric conversion layer and a yellow filter layer is provided, or where the electromagnetic wave absorption/photoelectric conversion portion is separated into two layers of high-sensitivity layer and low-sensitivity layer.
1 . An imaging sensor, which is a multipixel imaging sensor comprising an electromagnetic wave absorption/photoelectric conversion portion and a charge transfer/read-out portion, wherein
the electromagnetic wave absorption/photoelectric conversion portion has a stacked structure of at least three layers comprising a first layer capable of absorbing and photoelectrically converting blue light, a second layer capable of absorbing and photoelectrically converting green light, and a third layer capable of absorbing and photoelectrically converting red light, and
the electromagnetic wave absorption/photoelectric conversion portion further comprises at least one of an ultraviolet absorbing layer, an infrared absorbing layer, a black visible light absorbing layer, a fourth electromagnetic wave absorption/photoelectric conversion portion layer capable of absorbing light at a spectral wave length different from a spectral absorption wavelength of the three layers, and a yellow filter layer.
2 . The imaging sensor according to claim 1 , wherein the ultraviolet absorbing layer is disposed on an uppermost layer thereof.
3 . The imaging sensor according to claim 1 , wherein the infrared absorbing layer is disposed on an uppermost layer thereof.
4 . The imaging sensor according to claim 1 , wherein the black visible light absorbing layer is disposed on a lowermost layer thereof.
5 . The imaging sensor according to claim 1 , wherein the yellow filter layer is disposed as a lower layer of the electromagnetic wave absorption/photoelectric conversion portion.
6 . An imaging sensor, which is a multipixel imaging sensor comprising an electromagnetic wave absorption/photoelectric conversion portion and a charge transfer/read-out portion, wherein
the electromagnetic wave absorption/photoelectric conversion portion has a stacked structure of at least three layers comprising a first layer capable of absorbing and photoelectrically converting blue light, a second layer capable of absorbing and photoelectrically converting green light, and a third layer capable of absorbing and photoelectrically converting red light, and
at least one layer of the electromagnetic wave absorption/photoelectric conversion portion comprises two or more layers of a high-sensitivity layer and a low-sensitivity layer.
7 . The imaging sensor according to claim 1 , wherein the charge transfer/read-out portion is a Group IV, III-V or II-VI semiconductor having a charge mobility of 100 cm 2 /V.s or more.
8 . The imaging sensor according to claim 1 , wherein the charge transfer/read-out portion is a silicon device.
9 . The imaging sensor according to claim 1 , wherein the charge transfer/read-out portion has one of a CMOS structure and a CCD structure.
10 . The imaging sensor according to claim 1 , wherein the electromagnetic wave absorption/photoelectric conversion portion comprises a unit comprising an organic compound film and light-transmitting electrodes sandwiching the film.
11 . The imaging sensor according to claim 1 , wherein the electromagnetic wave absorption/photoelectric conversion portion comprises a unit comprising an organic compound-inorganic compound mixed film and light-transmitting electrodes sandwiching the film.
12 . The imaging sensor according to claim 1 , wherein the electromagnetic wave absorption/photoelectric conversion portion comprises a unit comprising an inorganic compound film and light-transmitting electrodes sandwiching the film.
13 . The imaging sensor according to claim 1 , wherein the electromagnetic wave absorption/photoelectric conversion portion and the charge transfer/read-out portion are electrically connected by an electrically conducting material.